Foundry Services

Advanced Packaging

Fujitsu’s advanced packaging and testing services include package design, simulation, assembly and testing.

Why Fujitsu’s advanced packaging services?
Providing unmatched, one-stop, turnkey packaging services, Fujitsu is the acknowledged global leader in advanced packaging technology, innovation, patents and manufacturing techniques, enabling our customers to meet market demands today and in the future.

• Technology leadership and cost-effective manufacturing maximize our customers’ competitive advantage.
• Our leadership in system-integrated packaging is unmatched. Technologies include wafer bumping, flip chip, enhanced RF, stacked, and wafer-level packaging.
• Global manufacturing support services include more than five million square feet of manufacturing floor space in over 20 dedicated factories.
• Lead-free packaging solutions maintain the company’s high standards for performance, reliability and quality.