Wafer Fab Service
Documentation
- 0.18µm node CMOS Process (CS80B)
0.18µm node CMOS Process (CS80B)
- 130nm node CMOS Process (CS90A)
130nm node CMOS Process (CS90A)
- 65nm CMOS Process Technology Video Presentation
65nm CMOS Process Technology Fujitsu to Highlight New 65-Nanometer Process Technologies, 10 Gigabit Ethernet and the WiMAX SoC at Annual DesignCon 2006, Booth 641
- 65nm CMOS Technology (CS200/CS200A) Factsheet (633KB PDF)
65nm node CMOS Process (CS200/CS200A)
- 90nm High-End CMOS Technologies Factsheet (405KB PDF)
Fujitsu was the first company to mass-produce ICs using high-yield 90nm technology.
- A highly reliable nano-clustering silica with low dielectric constant (k<2.3) and high elastic modulus (E=10 GPa) for copper
damascene process
A highly reliable nano-clustering silica with low dielectric constant (k<2.3) and high elastic modulus (E=10 GPa) for copper damascene process
- Fujitsu @ 65nm - Providing Solutions Through Integrated Design Services Video Presentation
Fujitsu’s experience in coordinating design flow between design and manufacturing groups, and in yield analysis and management, and explain how the company overcomes these challenges at deep submicron process levels.
- High-Performance / Low-Power 65nm CMOS Technology CS200 / CS200A (Technology Brief)
This paper describes Fujitsu's CS200/CS200A series 65nm CMOS technology with a focus on the technology's improved performance and low power consumption.
- High-Performance Semiconductor Manufacturing Services (243KB PDF)
Fujitsu provides its ASIC and COT customers with highlycompetitive, world-class technology and services.
- LCOS Backplane Process
0.35 um Process, 0.25 um process is under development,, 0.18 um process is in the planning stage
- New Low-K Material for 65nm Technology
New Low-K Material for 65nm Technology
- Your Best Choice for a 300mm, 90nm Foundry is Fujitsu (Capability Portfolio)
This paper discusses Fujitsu's Integrated Device Manufacturing (IDM) service business model.
