ASIC

Packaging

Fujitsu offers an extensive range of packages, including complete in-house turnkey package design.

Fujitsu's packaging solutions enable designers to reduce size and space requirements, producing higher levels of integration and performance. Options include:

• Flip-chip Ball Grid Arrays (FC-BGA)
  GHz range packaging solutions
• Tape-automated-bonding Ball Grid Arrays (TAB-BGA)
  Thermal-enhanced packaging solutions
• Enhanced Ball Grid Arrays (EBGA)
  Electrical and thermal-enhanced packaging solutions
• Fine-pitch Ball Grid Arrays (FBGA)
  Chip-Scale Packaging (CSP) solutions
• Face-down Heat-enhanced Ball Grid Arrays (FDH-BGA)
  Cost-effective thermal enhanced packaging solutions

Applications

• FC-BGA: Internet Router/Server, Workstation Public Transmission
• TAB-BGA: Internet Router PC Graphics
• EBGA: Internet Router/Server, Workstation Public Transmission
• FBGA: Cellular Phones, DVC, DSC
• FDH-BGA: Internet Router, PC Graphics