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High Speed "microGiGaCN® I/O and board-to-board stacking connectors, high reliability DDR3, DDR4 DIMM and PCIe card edge sockets.

Product Highlights

fcn-118x grounding springs

New grounding springs expand choices for mobile devices

The FCN-118X grounding spring series comes in free heights as low as 1.8mm and up to 2.5mm, and in working ranges of 0.85mm to 2.4mm for mobile designs.

Datasheet | Press Release


DDR4 DIMM sockets

DDR4 DIMM sockets feature a highly reliable contact structure

Split-beam contact construction greatly reduces intermittent signals and improves intermateability between memory card and pcb socket.

Datasheet | Press Release

Recent Press Releases

  • January 13, 2015
    Fujitsu Expands Grounding Spring Product Line for Mobile Designs
    Fujitsu Components America announced it has added two new, compact grounding spring connectors to its product offering to give designers more choices for the grounding requirements of printed circuit boards within the confines of mobile devices. Target applications include smartphones, tablet PCs and emerging wearable devices.
  • November 11, 2014
    Fujitsu DDR4 DIMM Socket Reduces Intermittent Signal Issues
    Fujitsu Components America announces the release of JEDEC-compliant, DDR4 DIMM sockets with a highly reliable contact structure that improves intermatability between the DDR4 memory card and pcb socket.
  • March 4, 2014
    Fujitsu to Exhibit World’s First 100Gps Multi-Mode QSFP28 Active Optical Cable
    Fujitsu Component Limited will exhibit its newly developed, quad small form-factor pluggable (QSFP28) active optical cable (AOC) for high-speed data transmission in booth #3445 at OFC2014 on March 9-13, 2014 in San Francisco. It is the world's first (1)100Gbps AOC (25Gbps×4 channels) using multi-mode fiber transmission technology.
  • January 21, 2014
    Fujitsu Introduces Grounding Springs for Mobile Devices
    Fujitsu Components America, Inc. today released a new series of grounding springs featuring a patented, robust structure and a wide working range for use in emerging mobile devices.