Electromechanical Components
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Electromechanical Components
Connectors
PCB and I/O interconnects for the latest standards and technologies. Copper interconnects in a scaleable performance range for a variety of high-speed module applications.
Relays
Electromechanical and solid-state relays for power, automotive and signal switching needs.
KVM Switches
Manage networks reliably with SERVIS intelligent KVM switches.
Keyboards/Pointing Devices
Custom desktop and notebook keyboards, and standard pointing devices.
Resistive Touch Panels
Premium quality solutions through industry-standard 4-wire and our unique 7-wire designs.
Thermal Printers
24V- and battery powered print mechanisms, subassemblies and accessories.
Wireless Modules
Wireless LAN, Bluetooth®, WLAN & Bluetooth® combo, and GPS modules.
Optical Modules
300pin MSA 10Gb/s Transponder, Pluggable Transceiver (XFP/X2/SFP), Optical Module for PON, LiNbO3 External Modulator, Receiver Module.
DC/DC Converters
Senpai series non-isolated point-of-load (POL) converters.
Recent Press Releases more 
- August 24, 2010 Sunnyvale, CA
- Fujitsu’s Full-Featured SPP Bluetooth® Modules Simplify Wireless Integration
Sunnyvale, CA, August 24, 2010 – Fujitsu Components America, Inc. today introduced a series of ultra-miniature, Class 1 and Class 2 Bluetooth modules that allows designers to easily and cost-effectively add wireless capability to their designs. The new devices feature embedded Serial Port Profile (SPP) firmware, a compact footprint and a broad command/event list to simplify and reduce integration time while meeting a wide variety of performance requirements.
- August 3, 2010 Sunnyvale, CA
- Fujitsu’s DDR3 DIMM Connector Design Enhances Memory Module Reliability
Sunnyvale, CA, August 3, 2010 – Fujitsu Components America, Inc. today released a DDR3 (Double Data Rate) DIMM (Dual Inline Memory Module) socket connector designed to reduce errors and intermittent faults associated with DDR3 memory modules.
- May 24, 2010 Sunnyvale, CA
- Fujitsu Introduces Ultra-Compact Wireless LAN Module with Antenna Diversity
Sunnyvale, CA, May 24, 2010 – Fujitsu Components America, Inc. today announced the release of a compact, 802.11a/b/g SDIO wireless LAN module with antenna diversity, low power consumption and reduced footprint.
- May 24, 2010 Sunnyvale, CA
- Fujitsu Markets Windows® 7 Logo-Certified, Resistive Multi-Input Panels in North America
Sunnyvale, CA, May 24, 2010 – Fujitsu Components America, Inc., the first manufacturer to obtain Windows® 7 logo certification for a resistive multi-input touch panel, is now marketing those touch panels in North America. Already in production in Japan since August 2009, the new multi-input panels’ increased functionality promises to expand touch capability into many new applications and markets, including harsh environments.
- May 17, 2010 Sunnyvale, CA
- Fujitsu Releases Hard Surface, Film-Film Touch Panels for Mobile Applications
Sunnyvale, CA, May 17, 2010 – Fujitsu Components America Inc. today released a durable, Film-Film resistive touch panel series targeting mobile applications. The plastic touch panels are 30-40% lighter than Film-Glass panels, withstand greater input loads, and have 2x the life of typical Film-Film panels.
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