GTM-WDZTTQ6
Skip to main content
  1. Home >
  2. Products >
  3. Electronic Devices >
  4. Semiconductors >
  5. SOP and TSSOP Package

SOP and TSSOP Package

 Overview |  SOP/TSSOP |  QFP/LQFP/TEQFP/HQFP |  SON/QFN |  FBGA |  PBGA |  TEBGA |  FC-BGA |  WL-CSP |  Bump on Pad |


title-sop

Features

  • Superior cost performance with a mature technology.
  • High reliability in mounting the package on printed circuit boards.
  • Thin and compact.

SOP and TSSOP Package external view

img-sopSOP img-tssopTSSOP

SOP and TSSOP Package cross section

illust-sop

SOP and TSSOP Package line-up

Package type Package size (mm) Mounting height (mm) Pin count
X Y Pin pitch 1.27mm Pin pitch 0.65mm Pin pitch 0.50mm
SOP 5.3 5.24 2.10 Max. 8 - -
7.5 12.7 2.65 Max. 20 - -
TSSOP 4.4 3.1 1.20 Max. - 8 -
4.4 4.96 - 14/16 -
4.4 6.5 - 20 24
4.4 7.8 - 24 30
4.4 9.7 - 28 -