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PBGA Package

 Overview |  SOP/TSSOP |  QFP/LQFP/TEQFP/HQFP |  SON/QFN |  FBGA |  PBGA |  TEBGA |  FC-BGA |  WL-CSP |  Bump on Pad |


PBGA

Features

  • Sealed with plastic resin to achieve high cost performance.
  • Superior support for multi-pin.
  • Package sizes at 27mmSQ, 31mmSQ, and 35mmSQ are available.

PBGA Package external view

PBGA Package External View

PBGA Package cross section

PBGA Package cross section

PBGA Package line-up

Pin count Package size (mm) Pin arrangement Pin pitch (mm)
X Y
256 (IO256) 27.0 27.0 4 rows 1.27
320 (IO256+TB64) 27.0 27.0 4 rows 1.27
321 (IO321) 19.0 19.0 Full Matrix(With nonexistent pins) 1.00
352 (IO352) 35.0 35.0 4 rows 1.27
353 (IO304+TB49) 31.0 31.0 4 rows 1.27
416 (IO352+TB64) 27.0 27.0 4 rows 1.00
416 (IO352+TB64) 35.0 35.0 4 rows 1.27
420 (IO420) 35.0 35.0 5 rows 1.27
480 (IO416+TB64) 27.0 27.0 5 rows 1.00
484 (IO420+TB64) 27.0 27.0 5 rows 1.00
484 (IO420+TB64) 35.0 35.0 5 rows 1.27
520 (IO420+TB100) 35.0 35.0 5 rows 1.27
543 (IO479+TB64) 27.0 27.0 6 rows 1.00
544 (IO480+TB64) 27.0 27.0 6 rows 1.00
564 (IO500+TB64) 31.0 31.0 5 rows 1.00
676 (IO676) 27.0 27.0 Full Matrix 1.00
676 (IO576+TB100) 35.0 35.0 5 rows 1.00
772 (IO672+TB100) 35.0 35.0 6 rows 1.00
808 (IO708+TB100) 35.0 35.0 5 + 2 rows 1.00
868 (IO672+TB196) 35.0 35.0 6 rows 1.00
900 (IO756+TB144) 35.0 35.0 7 rows 1.00
1156 (IO1156) 35.0 35.0 Full Matrix 1.00

*TB : Thermal Ball