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FC-BGA Package

 Overview |  SOP/TSSOP |  QFP/LQFP/TEQFP/HQFP |  SON/QFN |  FBGA |  PBGA | TEBGA |  FC-BGA |  WL-CSP |  Bump on Pad |


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Features

  • Support for ultra multi-pin by arranging the chip electrode over an area.
  • Good dissipation of heat produced from the high electric consumption chip by deployment of a heat spreader.
  • Capable of reduction of waveform distortion and high speed transmission (GHz level) for high frequencies.
  • Fully customizable according to the customer's requirements.

FC-BGA Package external view

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FC-PBGA Package cross section

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FC-CBGA Package cross section

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Multi-pin BGA Package road map

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Fujitsu will provide the most suitable SiP to the customer's requirements with our extensive implementation technologies.
Please do not hesitate to contact us.

FC-BGA Package line-up

FC-PBGA

Pin count (BGA) Package size (mm) Pin arrangement Ball matrix Pin pitch (mm)
X Y
484 23.0 23.0 Full Matrix 22 x 22 1.00
592 21.0 21.0 Full Matrix
(with nonexistent pins)
25 × 25 0.80
625 17.0 17.0 Full Matrix 25 × 25 0.65
625 27.0 27.0 Full Matrix 25 × 25 1.00
729 29.0 29.0 Full Matrix 27 × 27 1.00
900 31.0 31.0 Full Matrix 30 × 30 1.00
1020 33.0 33.0 Full Matrix 32 × 32 1.00
1156 35.0 35.0 Full Matrix 32 × 32 1.00
1206 37.5 37.5 Full Matrix
(with nonexistent pins)
36 × 36 1.00
1396 37.5 37.5 Full Matrix 37 × 37 1.00
1681 42.5 42.5 Full Matrix 41 × 41 1.00

FC-CBGA

Pin count (BGA) Package size (mm) Pin arrangement Ball matrix Pin pitch (mm)
X Y
625 27.0 27.0 Full Matrix 25 × 25 1.00
625 33.0 33.0 Full Matrix 25 × 25 1.27
729 35.0 35.0 Full Matrix 27 × 27 1.27
900 31.0 31.0 Full Matrix 30 × 30 1.00
900 40.0 40.0 Full Matrix 30 × 30 1.27
1089 42.5 42.5 Full Matrix 33 × 33 1.27
1156 35.0 35.0 Full Matrix 34 × 34 1.00
1225 45.0 45.0 Full Matrix 35 × 35 1.27
1369 37.5 37.5 Full Matrix 37 × 37 1.00
1681 42.5 42.5 Full Matrix 41 × 41 1.00
2116 47.5 47.5 Full Matrix 46 × 46 1.00