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Bump on Pad

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title

Features

Wafer process and bumping in consolidated assembly.
  • Technology supporting wide range of products from low-end applications such as mobile devices and digital electric household appliances to high-end applications such as servers.
  • Promote multi-pin with min. 50µm AL pad pitch.
  • Able to form wiring layer under a bump on demand.

Wafer Bumping Multimedia Presentation (Video)

PDF About wafer bumping

Bump external view

img-bump

Manufacturing process

illust-bump-process

Bump cross section

illust-bump

Technology Road map

roadmap-bump

Mass-production actual results

Wafer bumping A B C
Purpose High-end video 1seg tuner Image processing
Wafer size 300 mm 300 mm 300 mm
Chip size 9.52 × 14.44 mm 2.90 × 2.90 mm 5.10 × 4.50 mm
UBM size 0.080 mm 0.080 mm 0.200 mm
Bump height 0.085 mm 0.085 mm 0.100 mm
Bump pitch 0.176 mm 0.250 mm 0.400 mm
Chip thickness 0.550 mm 0.185 mm 0.450 mm
Bump material SnAg SnAg SnAg

Typical specification

(a) Bump pitch 176µm
(b) Bump height 85µm
(c) UBM size 80µm (typical)
(d) Passivation opening size 50µm (typical)
(e) Bump material SnAg
(or PbSn)
(f) Chip thickness
(the thinnest case)
200µm
illust-bump-mainspec



Micro bump chip specification (example)

(a) Bump pitch 50µm
(b) Bump height 18µm
(c) UBM size 32µm (typical)
(d) Passivation opening size 17µm (typical)
(e) Bump material SnAg
(f) Chip thickness
(the thinnest case)
150µm
illust-bump-microspec