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Advanced Packaging

 Overview |  SOP/TSSOP |  QFP/LQFP/TEQFP/HQFP |  SON/QFN |  FBGA |  PBGA |  TEBGA |  FC-BGA |  WL-CSP |  Bump on Pad |


Advanced Packaging

Packaging is a key technology that enables the miniaturization of electronic products. Fujitsu is in volume production of packages such as CSP (Chip Size Package or Chip Scale Package) and BGA (Ball Grid Array), which support high-density wiring technology.

Fujitsu also has a lineup of super-compact packages, including FBGA (Fine Pitch BGA) and WL-CSP (Wafer Level CSP), and high-pin-count packages such as PBGA (Plastic BGA) and TEBGA (Thermal Enhanced BGA). In addition, Fujitsu is now in production of the world’s smallest SON packages, which enable minimum size and weight limitations in today’s portable electronic applications.


Supporting Documents
IC PackageIC Package
icon-pdf3.1MB

pkg-roadmap

Larger View (86 KB)

Package Overview



Package type Package structure Pin
count
I/O
frequency
(GHz)
Heat resistance
ja(oC/W)
(0m/s)
Application
label-high FC-CBGA str-fccbga 450
to
2116
Max. 5 Min. 7 Routers, Servers, Workstations, Backbone transmission devices
FC-PBGA
(AISiC-LID)
str-fcpbga1 450
to
2116
Max. 2.5 Min. 7
FC-PBGA
(Cu-LID)
str-fcpbga2 450
to
1156
Max. 2.5 Min. 9 Routers, Personal computers, Graphics, Digital TVs, Set top boxes, Printers
TEBGA str-tfbga 256
to
1156
Max. 1.6 Min. 13
PBGA str-pbga 256
to
1156
Max. 1.6 Min. 15
label-consumer
FBGA str-fbga 66
to
906
Max. 1 17 to 60 Personal computers, Mobile phones, Digital video cameras, Digital still cameras, PDAs
SON
QFN
str-son 6
to
68
Max. 1.5 20 to 40 Mobile phones, Digital video cameras, Digital still cameras, PDAs
WL-CSP str-wlcsp 42
to
309
Max. 2.5 25 to 60 Mobile phones, Digital video cameras, Digital still cameras, PDAs
QFP
LQFP
str-qfp 48
to
304
Max. 2.5 15 to 100 Personal computers, Digital TV, Set top boxes, Printers
TEQFP str-tfq 48
to
256
Max. 2.5 15 to 35 Personal computers, Digital TV, Set top boxes

Wafer Bumping Multimedia Presentation (Video)