Material and structural optimization with accurate alignment technology for sequential lamination PCB enables high-speed transmission PCBs, tailored to customer needs and expectations.
Smoothing the surface of the signal pattern with our technology enables significant improvement on transmission loss without changing dielectric materials to high specification.
Our back drilling technology, decreasing open-stub length, reduces the transmission loss by reflection noise at high frequency operation. And stable high-speed transmission can be achieved.
Double sided press-fit connector for high-speed transmission can be applied with comprehensive technology by back drilling and sequential lamination technology. Press-fit connectors, mounted from both sides, shorten wiring length and increase wiring density.
Sequential lamination PCBs with hybrid dielectric materials enables low loss dielectric material layer, applied only to necessary surface layers for the high-speed signal transmission. And its combination with the back drilling technology reduces transmission loss by reflection noises at high-speed transmission.
We can solve the problem for high-speed transmission with total PCB solutions!
|Layer Construction||22 layers|
|PCB Size, Thickness||452mm × 192mm, 3.068mm|
|Layer Construction||28 layers (14 + 14) Sequential lamination|
|PCB Size, Thickness||480mm × 420mm, 3.6mm|
|Line / Space||100µm / 150µm|
|Via diameter (PTH, IVH)||Φ350µm, Φ120µm|
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