GTM-WDZTTQ6
Skip to main content

Probe Cards

Best Solutions for Customer ProblemsIssue-1 Maximization of wiring capacityIssue-2 Shorter lead-timeIssue-3 IVH structure for over 500mm sized PCBsApplication Fields and Structure1. Technology Application2. PCB Structures and their Strong Points3. Most Suitable Structure for Device Under TestOutline of PCB SpecificationsApplication Cases

Best Solutions for Customer Problems

We propose the best solutions for the most advanced semiconductor device testing, based on our know-how and technologies accumulated over half a century.

Issue 1Maximization of wiring capacity

Any layer IVH structure makes huge wiring capacity and flexibility in design for parts placements.
F-ALCS technology enables wiring capacity with over 35,000 wires that is twice as high as that of conventional PCBs.


Conventional PCB PCB with F-ALCS Technology
PCB Size φ440mm
PCB Structure PTH → Any Layer IVH
Layer Counts 90 Layers → 52 Layers
Thickness 8.0mm → 6.2mm
# of DUT / # of Pin Counts 900 / 19,400
Peripheral Devices / # of Pin 3,600 / 37,000
# of Nets (S / V / G) S: 12,500 / V: 300 / G: 1
# of Wires (S / V / G) S: 26,300 / V: 7,000 / G: 18,500

In comparison with the conventional PCB technology,
F-ALCS technology enables 38 layers (-43%) reduction.

Issue 2Shorter lead-time

Enables PCBs fabrication with one-time lamination and shortens fabrication lead time.
Our innovative technology F-ALCS reduces process steps by 50% and shortens delivery time.

New any layer IVH fabrication technology with one-time lamination

Different numbers of process steps for regular IVH PCB and F-ALCS PCB

Cross section of F-ALCS technology (Any layer IVH)

Cross section of F-ALCS technology (Any layer IVH) Image

F-ALCS technology enables not only huge wiring capacity
but also shortening of fabrication lead time.

Issue 3IVH structure for over 500mm sized PCBs

We introduce enhanced features of IVH technology for over 500mm sized PCBs.
Our Board to Board Connection and enhanced sequential lamination PCBs technology, that realizes aspect-free VIA structure, enables IVH structure even for large-sized PCBs.

Visual image of PCB with IVH structure

Hybrid Structure PCB with different materials

Hybrid Structure PCB with different materials Image

We propose enhanced IVH structure for over 500mm sized PCBs.

↓

We can solve the issues of semiconductor device testing.

Send an inquiry

Application Fields and Structure

As a recent trend, demand for large-sized probe card PCBs with huge wiring capacity has grown as the wafer size gets larger and the simultaneous measurements DUT increase. We provide a variety of stub-less VIA structures and high speed transmission technology for the wafer testing of a state-of-the-art devices.

1. Technology Application

We provide optimized probe card PCB technology for the upgrading requirements, addressing the simultaneous measurements DUT increase and the fine pitch probing.

Graph of "Pin count(DUT number) .vs. wiring capacity"
(Note) DUT: Device Under TEST

2. PCB Structures and their Strong Points

We propose a variety of PCB structures for upgrading specification requirements for probe cards.
The features for each PCB structure are shown below.

Strong points for each structure, in comparison with our products

Conventional Multilayer Structure IVH Structure
(Buildup, Sequential Lamination)
F-ALCS Structure
(Any layer IVH Structure)
Fabrication Lead time Fair Poor Fair
Design Flexibility Fair Fair Good
Parts Layout Flexibility Fair Fair Good
High Speed Transmission Fair Fair Good

We propose optimized PCB structures for customer requirements.

3. Most Suitable Structure for Device Under Test

We propose optimized PCB structures for probe card requirements of semiconductor devices, addressing high speed operation, narrow pitch probing and simultaneous measurement DUT increase.

Suitable structures for each type of DUT

Conventional Type Probe Card Interposer Type
Multi Layer Organic PCB
Conventional Multilayer / Buildup Structure IVH Structure
(Buildup, Sequential Lamination)
F-ALCS Structure IVH Structure
(Buildup, Sequential Laminate)
F-ALCS Structure
NAND FLASH Memory Poor Fair Good - Good
DRAM Memory Poor Poor Good - Good
System LSI (SI), Application Processor (AP) Poor Fair Good Fair Good
Contact Image Sensor (CIS) Fair Fair Good Poor Good

Visual image of conventional type and interposer type PCB

We propose optimized probe card structures for device-specific requirements

↓

We can solve the issues of semiconductor device testing.

Send an inquiry

Outline of PCB Specifications

Application Cases

Organic PCB applications for probe card and its PCB specifications

Organic Probe Card for Flash memory

Layer Construction 57 Layers
(F-ALCS Technology)
PCB Size, Thickness φ480mm, 6.2mm
# of Nets(Signal), R(Signal) 20,700wires, R ‹ 2.0Ω

Organic Probe Card for Flash memory Image

Organic Probe Card for DRAM Memory

Layer Construction 74 Layers
(F-ALCS Technology)
PCB Size, Thickness φ520mm, 7.4mm
# of Nets(Signal) 30,000wires (Signal)

Organic Probe Card for DRAM Memory Image

Organic Probe Card for Logic LSI
(Interposer Type, Multi Layer Organic PCB)

Layer Construction 42 Layers (7+28(F-ALCS)+7)
PCB Size, Thickness 100×100mm, 2.7mm
# of Nets, Pad Pitch, R(Signal) 500nets/DUT, 125µm, R ‹ 2.0Ω

Organic Probe Card for Logic LSI (Interposer Type, Multi Layer Organic PCB) Image

Organic Probe Card for Logic LSI
(Interposer Integrated Type)

Layer Construction 76 Layers ((11-14-11)+40)
PCB Size, Thickness φ280mm, 9.56mm
# of Nets, Pad Pitch 750nets/DUT (Signal), 125µm

Organic Probe Card for Logic LSI (Interposer Integrated Type)

Related Technology

F-ALCS Technology for Probe Cards

In addition to the increased demand for the large-sized probe card PCBs with huge wiring capacity, shorter fabrication lead-time has become necessary as the simultaneous measurements DUT increases.
We provide suitable PCB structures required for probe card PCBs with our state-of-the-art hybrid technologies that include F-ALCS technology.

Differences in wiring and mounting areas between regular IVH structure and F-ALCS structure Image

F-ALCS technology ensures highly reliable connections between VIAs through paste filling and metal bonding which allow more than two times higher wiring density with any layer IVH formation. It also enables PCBs fabrication with one-time lamination and shortens fabrication lead time.

Organic Probe Card for DRAM Memory Image

We provide PCB solutions for probe cards,
realizing ultra-high-density wiring.

GTM-PS6H6Z