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HDI PCBs

Best Solutions for Customer Problems Application Fields Outline of PCB Specifications How to reduce product size to 50% Thermal problems associated with the miniaturization Needs for high quality PCB/PCBA factory High Density PCB Application Fields Automotive Mobile and Omnipresent devices Others MV Series Buildup PCBs H-MV Series HDI PCBs

Best Solutions for Customer Problems Best Solutions for Customer Problems

We provide total solutions for not only PCBs/PCBAs but also for its system cabinet to meet the the miniaturization and thinner needs of our customer's product.

Issue 1How to reduce product size to 50%

  • We offer optimal PCB solutions with rigid, thin and lightweight materials to realize the miniaturization of the product.
  • We propose stress-strain analysis to solve warpage problems that associated with the product miniaturization and also the junction reliability problems for device mounting.

How to reduce product size to 50%

Issue 2Thermal problems associated with the miniaturization

We provide total solutions with our thermal and fluid analysis for the cooling problems of heat sopt occurred by the miniaturization.

Thermal problems associated with the miniaturization

Issue 3Needs for high quality PCB/PCBA factory

World-leading quality in PCB/PCBA manufacturing

Our Vietnam facility provides PCB manufacturing, parts assembly and customs clearance on the same site. We provide timely manufacturing support for our customers.

World-leading quality in PCB/PCBA manufacturing

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Application Fields Product Solution Fields

Our PCB production fields include a wide range of products and devices, such as high reliability automotive products, high density mobile devices and IoT modules. We introduce our product application below.

Sequential lamination and buildup PCB for Automotive

Application Layer Count Outline of Specifications
Car Navigation 6 to 10 Layers Thickness:1.2mm, L/S:70µm/90µm
ECU for Automotive 4 to 8 Layers
Sequential Lamination
Thickness:1.4mm, L/S:150µm/150µm
Drive Recorder 8 Layers (1-6-1) Thickness:1.2mm, L/S:70µm/90µm

Sequential lamination and buildup PCB for Automotive

High density buildup PCB for Smartphone and IoT modules

Application Layer Count Outline of Specifications
Tablet PC 10 Layers (4-2-4) Thickness:0.67mm, L/S:50µm/50µm
Smart Phone 10 to 12 Layers (5-2-5) Thickness:0.67mm, L/S:50µm/50µm

High density buildup PCB for Smartphone and IoT modules

High density buildup PCB for note PC

Application Layer Count Outline of Specifications
Mobile Note PC 10 Layers (2-6-2) Thickness:1.00mm, L/S:60µm/80µm
Note PC 10 Layers (2-6-2) Thickness:0.95mm, L/S:60µm/70µm

High density buildup PCB for note PC

High density buildup PCB for other products

Application Layer Count Outline of Specifications
Camera Module 8 Layers Thickness:0.85mm, L/S:75µm/75µm
Liquid-Crystal Projector 10 Layers Thickness:1.60mm, L/S:75µm/75µm

High density buildup PCB for other products

Outline of PCB Specifications Outline of PCB specifications

High density and high reliability PCB with buildup and sequential laminating technologies

MV Series Buildup PCBs

Multi-Via technology enables ultra-high density PCB.

Buildup PTH, up to 5-x-5 (x: 2-10)
Via menu Filled Via, Stacked Via, etc.
Narrow pitch CSP with 0.3mm pitch
Thinner thickness 0.3mm(6 layer), 0.58mm(10 layer)

H-MV Series HDI PCBs

Ultra high reliable PCB is enabled by the severe manufacturing management.

PTH PCB 4 layers to 20 layers
Sequential lamination 4 layers to 20 layers
Buildup PCB up to 2-x-2 (x: 2-10)

MV Series Buildup PCBsAny layer IVH PCB
12 layer (5-2-5)

H-MV Series HDI PCBsSequential lamination
8 layer (2+4+2)

Related Services

PCB Design

We provide the turnkey PCB solutions from circuit design through manufacturing to parts assembly.

PCB Design

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