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Fujitsu Microelectronics America, Inc.


ISSI Introduces New Stacked Multi-Chip Modules for Mobile Communications Market Delivered in Fujitsu’s leading-edge FBGA Packaging Technology


Santa Clara, CA, May 20, 2002 — Integrated Silicon Solution, Inc. (Nasdaq: ISSI), a leader in advanced memory solutions, today introduced a new family of stacked multi-chip package (MCP) Flash and SRAM memory products. The new products combine ISSI's 8Mb low-power asynchronous SRAM with Fujitsu's 64Mb or 32Mb NOR-type Flash memory in a stacked multi-chip module with fine-pitch ball grid array (FBGA).

ISSI's new MCPs target applications in 2.5G and 3G mobile phones, as well as other personal mobile appliances. They are ideal for applications requiring high performance and low power consumption in a small footprint because they place two types of memories into a single package. Applications include mobile phones, PDAs, handheld PCs, GPS handsets, wireless modems, two-way pagers and digital appliances.

In the space of one FBGA package, the MCP contains an ISSI asynchronous SRAM and a Fujitsu NOR-type Flash memory. As a leading supplier of asynchronous SRAM for more than a decade, ISSI now collaborates with world-class Flash memory supplier Fujitsu and its MCP manufacturing business unit to design, assemble and test MCPs.

Initially, ISSI will roll out four MCPs with varying density combinations (16Mb of Flash and 4Mb of SRAM, 32Mb of Flash and 8Mb of SRAM, 64Mb of Flash and 8Mb of SRAM, and 32Mb of Flash and 4Mb of SRAM). These MCPs represent the primary markets in the state-of-the-art mobile phone design.

Low Voltage, Minimal Standby Current
The ISSI asynchronous SRAM accommodates today's most popular chipsets by providing low supply and I/O voltages of 2.7V to 3.3V, along with low standby power of 5 micro Amps, and 70 ns to 85 ns access times. The SRAMs are built using 0.15-micron process technology.

The Fujitsu NOR-Type Flash memory stores the data, operation codes and various communications protocols. It provides simultaneous read/write capability between any two banks, along with low standby current of just 0.2 micro Amps and the 2.7V to 3.3V voltage range required by the target markets.

ISSI /Fujitsu Collaboration
"ISSI is pleased to be associated with Fujitsu, a world-class Flash memory supplier, to ensure reliable sourcing of Flash memory for ISSI's MCP devices," said Sanjiv Asthana, Vice President of Marketing at ISSI. "Fujitsu is providing Flash as part of assembled and tested MCPs, which simplifies production logistics. By working with Fujitsu, we can provide the market with industry-leading experience and expertise, along with very high product quality and reliability."

"These new FBGAs are a compact, cost-efficient design solution for the coming generation of mobile appliances, which demand low power and very small footprints," said Keith Horn, Vice President of Marketing at Fujitsu Microelectronics America.

Price and Availability
The new MCPs from ISSI are available in volume production. Pricing will range from $10.00 to $20.00.


About ISSI

ISSI is a technology leader in high performance memory semiconductors. The company designs, develops and markets memory products used in networking, Internet infrastructure, telecommunications, wireless products, handheld devices, computer peripherals, and automotive electronics. ISSI's products incorporate state-of-the-art circuit design and advanced process technology. The company's high speed and low power SRAMs, low to medium density DRAMs, MCPs (combining Flash and SRAM), and family of EEPROMs enable designers to meet the demanding connectivity, portability, and bandwidth requirements of today's high tech products. ISSI is headquartered in Silicon Valley with worldwide offices in China, Europe, Hong Kong, Taiwan and Korea. Visit our web site at www.issi.com.

About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics America, Inc. (FMA) designs, markets and supports a broad range of semiconductors and electronic devices. For product information, call 1-800-866-8608, or visit the company web site at http://www.fma.fujitsu.com


Press Contacts

Emi Igarashi

Fujitsu Microelectronics America, Inc.
Tel: (408)-737-5647
E-mail:eigarash@fma.fujitsu.com


Dick Davies

IPRA
Tel: (415)-777-4161
E-mail:ipra@mindspring.com


Shelly Mattson

Integrated Silicon Solution, Inc.
Tel: (408)969-4669
E-mail:shelly_mattson@issi.com


Larry Hayes

Hayes Marketing
Tel: (408)-871-0135
E-mail:larry@hayesmktg.com