Fujitsu Microelectronics America, Inc.

Fujitsu Introduces High-Capacity Four-Stacked MCP and Two-Stacked MCP for Package Standardization

Two new MCPs provide industry's largest memory capacity for mobile devices

San Jose, CA, February 20, 2002 — Fujitsu Microelectronics America, Inc. today introduced the industry's first four-stacked multi-chip package (MCP), the MB84VZ064A. The new MCP is equipped with a pair of 64 Megabit NOR dual-operation flash memory chips and 32 Megabit mobile Fast Cycle RAM (FCRAM™) with an asynchronous SRAM interface and 8 Megabit SRAM.

Fujitsu also announced a two-stacked MCP that incorporates 16/32/64 Megabit FCRAM, providing mobile product developers with fast cycle memory in a 9mm x 9mm package. Samples of the new-stacked MCPs, which provide the industry's largest memory capacity, are available now. Volume production is planned for the second calendar quarter of 2002.

New MCPs Significantly Reduce Total Footprint
The new four-stacked MCP combines the memory used in two existing MCP products in a single four-chip stacked version with a 103-ball (10.0 x 9.0 x 1.4 mm) plastic BGA package. Combining these chips into one package reduces the total mounted surface area by about 63 percent of the previous combination of packages.

Fujitsu's new MCP series includes two 64 Megabit NOR-type dual-operation flash memory chips for storing programs and data. This flash memory, which was fabricated using Fujitsu's 0.17-micron process technology, runs faster than previous NOR-type flash products, performing sector erase operations in 0.2 seconds, compared with one second for previous models. Access speeds are 70ns, compared with 80ns for previous models. The new MCP, which includes significantly improved electrical features, incorporates 32 Megabit mobile FCRAM and 8 Megabit SRAM. This new second-generation FCRAM requires an operating current of only 25mA, and achieves access speeds of 70ns.

The two-stacked MCP combines flash memory and RAM (either mobile FCRAM or SRAM) into one 9mm x 9mm, 65-ball PBGA package, reducing the total mounted surface area by as much as 61 percent of the previous packages.The new series comes in four versions including a 64 Megabit NOR-type dual-operation flash memory chip with either an 8 Megabit SRAM chip or a 16/32/64 Megabit mobile FCRAM chip with an asynchronous SRAM interface.

New Mobile Phone Technology Requires New Kinds of Memory
Recent advances in mobile phone technology, driven by improved functionality and the addition of new services, have generated demand for memory with high levels of functionality and capacity. However, there is no standardization in the packaging of the chips that power them. So, if any changes are required in the memory capacity of the chips during the product development phase, the memory-device-mounted area of the printed circuit board requires a redesign, resulting in additional costs and time delays. Also, the new mobile technology requires stacked memory that is more compact and runs on less power, but provides more capacity and speed.

Fujitsu's new MB84VZ064A series solves these challenges by standardizing the memory packages for mobile phones. Changes in mobile phone specifications during product development can be accommodated by mounting an MCP with the required combination of memory capacity and functions, saving time and expense. For storing data and programs, the MCP uses flash memory fabricated using 0.17-micron process technology with the same characteristics as the four-stacked MCP.

Fujitsu's 16, 32 and 64 Megabit FCRAM is designed for mobile phones, supplying access speeds of 80ns/70ns/70ns, respectively. Standby current is 70, 100 and 150 microamps, and powerdown current is just 10 microamps.

Pricing and Availability
Pricing for the two-stacked MCP begins at $26 each in 100-unit quantities. Pricing for the four-stacked MCP starts at $60 each in 100-piece units. Samples are available now, and production will begin in the second calendar quarter of 2002.

Note to Editors:
A low-resolution picture relevant to this press release can be found by following the link:
http://www.fma.fujitsu.com/pr/mcp.jpg

For a high-resolution download option please follow the link:
http://www.fma.fujitsu.com/pr/mcp.zip

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About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics America Inc. designs, markets and supports a broad range of advanced semiconductor products. For product information please call 1-800-866-8608 or visit the Fujitsu Microelectronics America's website at http://www.fma.fujitsu.com

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