Fujitsu Microelectronics America, Inc.

Fujitsu Delivers Industry's First Copper FCBGA Packaging to Altera Corporation

San Jose, CA, July 12, 2001 — Fujitsu Microelectronics, Inc. (FMI) today announced it has delivered the first copper interconnect Flip-Chip Ball Grid Array (FCBGA) package for Altera Corporation's (NASDAQ:ALTR) Programmable Logic Devices (PLDs).

The flip-chip technology from Fujitsu offers significant advantages in package performance for Altera's APEX 20KE, APEX 20C, APEX II and Mercury devices, as well as for the Excalibur embedded processor solution. The technology improves device performance by enabling better overall thermal stress management and reducing I/O inductance. The FCBGA allows for the design of more advanced packaging solutions that are ideal for current and future high-speed networking and telecommunications systems.

"Fujitsu has proven technical leadership in eutectic and high-lead wafer bump technologies," said Nader Radjy, director of foundry business management at Altera. "Fujitsu's high level of engineering expertise resulted in ramping to significant volumes very rapidly, which enabled Altera to launch new and advanced products quickly and on time. We value the ongoing technology collaboration between the two companies."

"Fujitsu's flip chip packaging services span a wide range of advanced technologies, including large die, copper interconnect and lead-free. Altera is very happy to have found a supplier that can respond to a constantly changing market with efficient and proven solutions," said Vincent Wang, senior director of package development at Altera Corp.

This announcement represents a major milestone in the advanced packaging technology collaboration between Fujitsu and Altera. Fujitsu, a long-time leader in advanced packaging solutions, has offered wafer bumping and FCBGA packaging subcontract services for Altera's high-density PLD family products since 1999. Important technology milestones include providing packaging for unusually large die (package size) applications, such as 600 square millimeters or larger, wafer bumping on copper and lead-free FCBGA.

"Fujitsu's experience in advanced packaging has helped establish unprecedented levels of industrial reliability," said Toshio Hamano, director of technology at FMI's APT group. "For example, using Fujitsu's organic build-up substrates, we have achieved JEDEC Moisture Sensitivity Level 3 and Temperature Cycle Test of 2000 cycles at zero to 100 degrees centigrade, a significant achievement."

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About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics, Inc. (FMI) designs, manufactures and markets a broad range of semiconductors and electronic devices. For product information, please call 1-800-866-8608, or visit the company web site at http://www.fma.fujitsu.com/apt/Main01.asp

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