Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics, Inc. Announces First Packaging Options without Lead (Pb); First Step in Companywide Program for All No-Lead Products by December 2002

San Jose, CA, May 22, 2001 — Fujitsu Microelectronics, Inc. (FMI) today introduced its new lead-free Ball Grid Array (BGA) and Quad Flat Pack packages, the first products in the company's program to supply only lead-free components and packages. A broad range of ASIC, memory, microcontroller and other LSI devices are now available in these lead-free packages.

In November 1999, Fujitsu announced plans for a staged reduction of the use of lead in its products. The company will make its entire product line lead-free by December 2002. As an initial step, a new line-up of LSI devices and packages became available with lead-free solder in the Japanese market in October 2000. Some of the packages, such as BCC++ (Bump Chip Carrier) for RF devices and Super CSP (Wafer-level CSP) for flash memory, were designed as lead-free solutions from the start. The company is now working to provide LSI devices with terminals that are plated without lead or with lead-free solder. Half of all the printed circuit boards used in Fujitsu's products will be free of lead by the end of 2001.

"Fujitsu has initiated a corporatewide program to provide lead-free products, and FMI is pleased to be executing this program in our American markets," said Ken Iida, FMI's president. "The goal is to totally eliminate lead from all our products by the end of 2002. We are including our outside suppliers in this mission. The introduction of these new lead-free packages is the latest step in our global lead-elimination effort."

Iida said that Fujitsu has developed two kinds of lead-free solder, one for PCBs and the other for parts assembly. They were used to assemble the company's GS8900 global server series, which was introduced last October. In its 1999 announcement, Fujitsu said it was working on the kinds of lead-free solder that can replace all lead-based versions.

For more information about Fujitsu's lead-free initiative, please visit
http://pr.fujitsu.com/jp/news/1999/Nov/16-2-e.html.

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About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics, Inc. (FMI) designs, manufactures and markets a broad range of semiconductors and electronic devices. For product information, please call 1-800-866-8608, or visit the company web site at http://www.fma.fujitsu.com/apt/Main01.asp.

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