Fujitsu Microelectronics America, Inc.

TRW and Fujitsu Complete Flight Production of Extremely High-Density Digital Chips for First Astrolink Payload

Designed for next generation of cell phones now in planning stages in U.S.

San Jose, CA, April 19, 2001 — Fujitsu Limited and Fujitsu Microelectronics, Inc. (FMI) today introduced a new stacked Multi-Chip Package (MCP) with 64 Mbit dual-operation flash memory and 32 Mbit Mobile FCRAMä, designed to provide the low power and high density required for new cellular telephones.

Fujitsu's new MB84VD23483EJ combines the NOR-type flash memory and the mobile FCRAM with an asynchronous interface, which is compatible with static RAM. Power consumption for flash in standby mode is only five microamps, maximum, and only 100 microamps for mobile FCRAM. In power-down mode, consumption is only 10 microamps. Access times are typically 90ns for both flash and FCRAM. Power-supply requirements are 2.7V to 3.1V.

The MCP's low power, high density and SRAM-compatible interface make it an excellent device for the new generation of cell phones that provide email, imaging, Internet access, games and other features, according to Fumio Baba, vice president of FMI's System Devices Group.

"This spring, the new IMT 2000 mobile-communication-system service begins in Japan, and represents the first stage of a worldwide trend toward comprehensive cellular phones that provide users with a new set of features ranging from Internet-page downloads to video games," said Baba. "The timing of this introduction in the U.S. is excellent, because the leaders of third-generation mobile technology are now in the early stages of their device-evaluation programs, and the new stacked multi-chip package meets all their low power, high speed and high density requirements."

The new MCP continues Fujitsu's worldwide leadership in leading-edge packaging solutions for next-generation cellular, computing and networking designs, according to Baba.

Samples of the MB84VD23483EJ MCP in plastic BGA packages will be available by the end of May, and mass production will start in October. Pricing will start at approximately $60 each.

Specifications

Product Configurations
64 Mbit NOR-type dual-operation flash memory (I/O x16)/ 32 Mbit Mobile FCRAM (I/O x16)

Access Time
Random read/program (1 word)
Flash memory: Max. 90ns / Typical 16ns
Mobile FCRAM: Max. 90ns Power Supply Vcc=2.7V-3.1V

Low Power Consumption
Stand-by mode:
5 mA (max.) (flash memory)
100 mA (max.) (Mobile FCRAM)

Power-down mode:
10 mA (max.) (Mobile FCRAM)

Read mode:
18milliA (max.) f=5MHz (flash memory)
30milliA (max.) (Mobile FCRAM)

Program/erase mode:
40milliA (max.)

Number of erase / program operation: 100,000 (min.)(flash memory)

Packaging
Standard plastic BGA 81 balls

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About Fujitsu

Fujitsu Limited (TSE: 6702) is a leading provider of Internet-based information technology solutions for the global marketplace. Comprising over 500 group companies and affiliates worldwide -- including ICL, Amdahl and DMR Consulting -- it had consolidated revenues of 5.26 trillion yen ($49.6 billion) in the fiscal year ended March 31, 2000. Fujitsu's pace-setting technologies, world-class computing and telecommunications platforms, and global corps of over 60,000 systems and services experts make it uniquely positioned to harness the power of the Internet to help its customers succeed. Altogether, the Fujitsu Group has 188,000 employees and operations in over 100 countries. Home page: http://www.fujitsu.com/ (English) or http://jp.fujitsu.com/ (Japanese).

About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics, Inc. (FMI) designs, manufactures and markets a broad portfolio of semiconductors and electronic products. For more information, please call 1-800-866-8608 or visit the web site at http://www.fma.fujitsu.com/flash/flash3Vmcp.asp?pn=3V-only%20MCP&sec=flash

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