Fujitsu Microelectronics America, Inc.

Fujitsu Announces Capacity Expansion of Wafer Bumping and FlipChip-BGA Assembly Services

Flip-chip advanced packaging is key feature for high-frequency devices

San Jose, CA, March 13, 2001 — Fujitsu Limited, Fujitsu Tohoku Electronics Ltd. and Fujitsu Microelectronics Inc. (FMI) will accelerate plans to expand Wafer Bumping and FlipChip-BGA (FCBGA) capacity, based on strong demand for advanced packaging services for high-end ASIC, DSP, PLD, microprocessor and Fast SRAM markets.
The expansion will increase available wafer bumping capacity to more than 20,000 wafers per month, with FCBGA assembly capacity of approximately 800,000 units per month beginning in April 2001.

Key for New Generations of Networking and Communications Products
FCBGA packages feature a ball area array and direct die attachment configurations, which enable excellent signal integrity at very high frequencies as well as exceptional power management.
"FlipChip-BGA is the key and ideal packaging solution for new generations of products operating at gigahertz speeds," said Toshio Hamano, director of FMI's Advanced Packaging Technology. "Flip chip technology is now becoming critical and often necessary for networking, telecommunications and complex computing applications. The majority of advanced future designs are expected to utilize FCBGA packaging."

Fujitsu's Expertise and Experience in Advanced Packaging
Fujitsu has been shipping bumped wafers since 1991 and offering FlipChip-BGA packaging services since 1996. The company now provides wafer bumping using eutectic, high-temperature and lead-free materials, and can fabricate 11,000 bumps on a die with a 153 micron bump pitch using lead-free solder. Fujitsu can also provide FCBGA packaging services using organic BT substrate, organic build-up substrate or high CTE glass ceramics. For example, bumping and packaging a die with a significantly large area, such as 26 x 23mm, requires using organic build-up substrates of 33 ´ 33 mm. A new technique using polytetrafluoroethylene (PTFE) substrates is currently under development. Fujitsu, which has U.S. patents for FCBGA, currently offers ball counts ranging from 120 to 2,116.

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About Fujitsu

Fujitsu Limited (TSE: 6702) is a leading provider of Internet-based information technology solutions for the global marketplace. Comprising over 500 group companies and affiliates worldwide -- including ICL, Amdahl and DMR Consulting -- it had consolidated revenues of 5.26 trillion yen ($49.6 billion) in the fiscal year ended March 31, 2000. Fujitsu's pace-setting technologies, world-class computing and telecommunications platforms, and global corps of over 60,000 systems and services experts make it uniquely positioned to unleash the infinite possibilities of the Internet to help its customers succeed. Altogether, the Fujitsu Group has 188,000 employees and operations in over 100 countries. Internet: http://www.fujitsu.com.

About Fujitsu Microelectronics America, Inc.

Fujitsu Microelectronics, Inc. (FMI) designs, markets and manufactures a comprehensive portfolio of advanced semiconductor and electronic devices. These products are carefully defined and co-developed with worldwide industry leaders to assure that they fulfill requirements for significant new applications in computing, communications, networking, convergence designs and multimedia. For product information, call 1-800-866-8608 or visit the web site at http://www.fma.fujitsu.com/apt/Main01.asp

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