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2004 Press Releases by Subsidiary
Fujitsu Interconnect Technologies
- 9 March 2004 Tokyo
- Fujitsu Develops World's First Multi-layer PCB Capable of 5Gbps Transmission and 4000 Pin Mounting
Tokyo, March 9, 2004 – Fujitsu Laboratories Ltd., Fujitsu Interconnect Technologies Ltd., and Fujitsu Limited today announced the joint development of new manufacturing technologies for large-sized, high-count multi-layer printed circuit boards (PCBs) that enable support of 5Gigabits per second (5Gbps) high-speed transmission and 4000 pin high-density mounting (0.8mm pitch). Fujitsu's new technologies succeed in improving manufacturing yields and significantly reducing production time for high-count multi-layer PCBs. The technologies were developed for use in such areas as next-generation, high-speed servers and telecommunication base station equipment, which demand fast transmission speeds and high-density mounting.
