Fujitsu Components America | Fujitsu Computer Products of America | Fujitsu Consulting | Fujitsu Interconnect Technologies | Fujitsu Microelectronics America | Fujitsu Network Communications |
2003 Press Releases by Subsidiary
Fujitsu Interconnect Technologies
- 21 October 2003 Sunnyvale, CA
- Fujitsu Interconnect Technologies Introduces Third-Generation Multi-Via Technology to Reduce Manufacturing Costs for Printed
Circuit Boards
Sunnyvale, CA, October 21, 2003 – Fujitsu Interconnect Technologies Limited (FICT) today introduced products based on its next-generation Multi-Via 3 (MV3) technology, which reduces manufacturing costs and makes it easier to design multi-layer Printed Circuit Boards (PCBs).
- 21 January 2003 Kawazaki, Japan
- Announcing the Joint Development of a Printed Wiring Board with a New Structure in Partnership with Matsushita Electric Components
Co., Limited and Fujitsu Interconnect Technologies, Limited
Kawazaki, Japan, January 21, 2003 – Matsushita Electric Component Co., Limited, President, Koshi Kitadai, (hereinafter referred to as “Matsushita᾿) and Fujitsu Interconnect Technologies Limited, President Yukichi Takeda, (hereinafter referred to as “FICT᾿) have reached an agreement on launching the joint development of a new Printed Wiring Board, which is expected to answer the mounting needs of following generation, by integrating “ALIVH (1)᾿ of Matsushita and “MV-technology (2)᾿ of FICT.
