- About FEEU
- High-End PCBs & Interconnect Technologies
- Standard and Advanced PCBs
- Advanced Packaging
- Standard Components
High-density wiring structure for high-density bump interconnect.
Suitable for high frequency operation over 10GHz.
GigaModule-EC adopts a technology which enables decoupling capacitors to be embedded on a substrate right beneath a LSI to operate in high frequencies with low voltages. The GigaModule substrate can be used for build-up or coreless substrates.
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