Our state-of-the-art technology provides innovative organic PCBs, best suited for advanced semiconductor device testing probe cards. Our hybrid combination technology with high layer count fabrication, fine pitch patterning and F-ALCS technology proposes PCBs that best suits the unique needs of each customer.
Our conventional PTH type, buildup IVH type and the hybrid type PCB structures enable aspect-free micro VIAs and huge wiring capacity.
0.5mm pitch through hole technology and fine pitch patterning process technology are suitable for CSP burn-in test applications and performance boards for device testing.
Conventional PTH type, Build-up IVH type and Hybrid type PCB enables aspect free small Via with our Board to Board Connection(BBC) technology.
0.5mm pitch through hole PCB for fine pitch CSP burn-in test applications in mass production.
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