This is a web page for the innovative F-ALCS technology which Fujitsu Interconnect Technologies (FICT) has developed. This technology is able to meet any customer needs and requirements about printed wiring board manufacturing.
With our cutting edge HDI PCB, we provide total solution including design, manufacturing and assembly for automotive, IoT modules and Omnipresent products.
FUJITSU INTERCONNECT TECHNOLOGIES's organic technology is best suited for advanced semiconductor device testing probe cards, performance boards and burn-in card PCBs.
FICT enables to provide Ultra-Thin & High-density wiring structure, applying core layer free, full build-up, and full stacked-via technology.
We provide comprehensive solutions across all stage of the product development from circuit design through prototype development to mass production.
Electrical Simulation / Physical Simulation
Share this page
Copyright 1995 - 2017 FUJITSU