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High-End PCBs & Interconnect Technologies


This is a web page for the innovative F-ALCS technology which Fujitsu Interconnect Technologies (FICT) has developed. This technology is able to meet any customer needs and requirements about printed wiring board manufacturing.

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Multilayer PCBs

  • High Density Interconnect PCBs
  • High Speed Transmission PCBs
  • Thick Copper PCBs


With our cutting edge HDI PCB, we provide total solution including design, manufacturing and assembly for automotive, IoT modules and Omnipresent products.

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Hybrid PCBs

FUJITSU INTERCONNECT TECHNOLOGIES's organic technology is best suited for advanced semiconductor device testing probe cards, performance boards and burn-in card PCBs.

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FICT enables to provide Ultra-Thin & High-density wiring structure, applying core layer free, full build-up, and full stacked-via technology.

  • FC-BGA Substrates GigaModule-2
  • Coreless FC-BGA Substrates GigaModule-4

PCBs assembly

  • Prototype Assembly
  • Reliability Evalution, Failure Analysis

Board Design

We provide comprehensive solutions across all stage of the product development from circuit design through prototype development to mass production.

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Electrical Simulation / Physical Simulation

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  • Packaging Stress Analysis


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