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High-End PCBs & Interconnect Technologies

F-ALCS

This is a web page for the innovative F-ALCS technology which Fujitsu Interconnect Technologies (FICT) has developed. This technology is able to meet any customer needs and requirements about printed wiring board manufacturing.

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Multilayer PCBs

  • High Density Interconnect PCBs
  • High Speed Transmission PCBs
  • Thick Copper PCBs

HDI PCBs

With our cutting edge HDI PCB, we provide total solution including design, manufacturing and assembly for automotive, IoT modules and Omnipresent products.

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Hybrid PCBs

FUJITSU INTERCONNECT TECHNOLOGIES's organic technology is best suited for advanced semiconductor device testing probe cards, performance boards and burn-in card PCBs.

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Substrate

FICT enables to provide Ultra-Thin & High-density wiring structure, applying core layer free, full build-up, and full stacked-via technology.

  • FC-BGA Substrates GigaModule-2
  • Coreless FC-BGA Substrates GigaModule-4

PCBs assembly

  • Prototype Assembly
  • Reliability Evalution, Failure Analysis

Board Design

We provide comprehensive solutions across all stage of the product development from circuit design through prototype development to mass production.

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Simulation & Consulting

Electrical Simulation / Physical Simulation

  • Signal Integrity
  • Power Integrity
  • Thermal Management Analysis
  • Packaging Stress Analysis

Products

  • Fujitsu Servers
  • Storage
  • Client Computing Devices
  • Peripheral devices
  • Software

Services

  • Application Services
  • Biometrics and Identity Management
  • Strategic Business Consulting
  • Dynamic Infrastructures

Features

Corporate

  • Fujitsu in the UK and Ireland
  • Corporate Profile
  • Careers at Fujitsu
  • Corporate Responsibility
  • Modern Slavery Statement

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