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Rigid Capabilities

Sophic is continuously innovating the technology improving their Rigid PCB capability to meet customers High-Tech requirement with High-Density, High Multilayer, Greater Aspect Ratio, better Impedance Controlled product.

Description Technological Data
Layers 1-10 Layers
Max. Board Size 610 x 700 mm
Min. Board Thickness 0.6 mm (4 layers) / 0.9mm (8 layers) / 1.2mm (10 layers)
Max. Board Thickness 4 mm
Max. Copper Thickness 3 OZ
Min. Inner Line Width /
5 mil (0.125mm) / 4 mil (0.1mm)
Min. Outer Line Width /
5 mil (0.125mm) / 4 mil (0,1mm)
Min. Finish Hole Size 8 mil (0.2 mm)
Max. Aspect ratio 8:1
Min.Via/Pad via: dia. 0.2mm / pad: dia. 0.4mm
thickness tolerance
±10% (≥1.0mm; ±0.1mm (≤1.0mm))
Finished hole size
tolerance (PTH)
±3mil (0.075mm); press fit: ±2mil (0.05mm)
Finished hole size tolerance
±2mil (0.05mm)
PTH hole copper
min 25um (1.0mil)
Hole Position Deviation ±2mil (0.05mm)
Outline Tolerance ±4mil (0.1mm)
S/M Pitch 3mil (0.08mm)
Insulation Resistance 1 x 1012Ω
Thermal Shock 3 × 10Sec @ 288 °C
Warp and Twist ≤0.5%
Peel Strength 1.4N / mm
Solder Mask Abrasion ≥6H
Flammability 94V - O
Impedance Control ±10%
Min solder dam/bridge 0.1mm (4 mil)
Surface Finish
HAL, LF HAL, Immersion gold/tin/silver, OSP
G/F Au thickness 0.76um max ( 30u” max )
V-cut angle 30° 45° 60°, tolerance +/- 5°
Mini V-cut board
V-cut remain thickness
Profiling mode Routing & Punching
Profiling tolerance ±0.1mm (4mil)
Capacity 250,000 square feet (Month)