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Lead Frames
To meet demands for improved thermal radiation, electrical and other characteristics imposed by larger and more sophisticated semiconductor devices, Shinko Electric is developing and producing a diverse selection of new packages and lead frames. Structural innovations, such as building a heat spreader with a single-layer lead frame or using composite aluminum bodies, are making lead frames more functional - and less expensive than ever. The steady accumulation of constituent technologies is bringing new potentials to view.
Lead Frame
Chip-Size Package Applying Lead Frame processing technology (QFN, Bump Chip Carrier)
Heat Spreader
