THE POSSIBILITIES ARE INFINITE

Lead Frames

To meet demands for improved thermal radiation, electrical and other characteristics imposed by larger and more sophisticated semiconductor devices, Shinko Electric is developing and producing a diverse selection of new packages and lead frames. Structural innovations, such as building a heat spreader with a single-layer lead frame or using composite aluminum bodies, are making lead frames more functional - and less expensive than ever. The steady accumulation of constituent technologies is bringing new potentials to view.

Lead Frame

Chip-Size Package Applying Lead Frame processing technology (QFN, Bump Chip Carrier)

Heat Spreader