Core Technologies | Glass-to-Metal Seal | Precision Contact Parts | Ceramic Package | SurgeProtection Devices | Quality Information System |
Core Technologies
The core technology described here form the basis for the product developing power of Shinko electric Industries. For example, it has fostered a wide range of technologies such as precision stamping technology to stamp a pieced of metal 1mm wide into six or seven sections, plating technology to form high- quality packages, and thermal and electrical simulation technology to form the basis for optimum package designs, each of which aims at being global No. 1.
We consider it a mission of Shinko Electric Industries to continue to provide what customers demand by combining technologies in various ways.
Multi layer technology
This technology for stacking insulating layers and circuit patterns, layer-on- layer, on a core board, is indispensable for
making the next-generation high-density boards. This wiring design requires highly advanced electronic technology.
Organic material processing technology
This technology requires a package with high functions, which uses the same organic materials as those of a printed-circuit
board. It is also applied to achieve a compact and thin package using polyamide tape.
Plating technology
This technology is indispensable for manufacturing Lead Frames and forming solder bumps for Flip Chip on the entire surface
of an IC chip. Plating technology is literally a core technology of Shinko Electric Industries.
Thin film technology
This thin film technology has a wide range of applications in the advanced semiconductor package field, such as the making
a package of the same size as an IC chip.
Precision processing technology
This technology is indispensable for manufacturing Lead Frames. Our company has commercialized Lead frames having an ultra-line
inner lead pitch of 138 m m, which is the finest in the world.
Hermetic seal technology
This is a traditional technology of Shinko electric Industries, which has been inherited since its foundation. It is now used
for manufacturing Glass-to-Metal Seals.
Photolithography and etching technology
Photolithography technology to form a fine circuit pattern using an optical method and etching technology to melt and remove
unnecessary portions are indispensable technologies for fine processing.
IC assembly technology
We assemble various advanced semiconductor devices. Technology to make IC chips into final products is feedback to develop
next-generation technologies.
Analytical evaluation technology
To analyze and evaluate whether the necessary characteristics are met, we have various advanced analyzers to feedback the
data they provide for developing new products.
Design analysis technology
Through design technology combining high-speed design and simulation technology using an optimum CAD system, we make it possible
to shorten the development period and reduce costs.
Manufacturing equipment development technology
We internally manufacture equipment and production lines by developing technologies for advanced control and automatic inspection
through image processing, as well as developing construction methods and accurate mechanisms.
Information system technology
By developing supply chain management (SCM) through such advanced IT technologies as Java TM and XML, we are quickly meeting
the various needs of our customers.
