Resources

Basic Research

With basic research, the company is able to provide packages with superior performance and enhanced mounting technology. Basic Research covers a range of work in disciplines spanning electricity, physics, and chemistry.

Materials Development

The steady evolution of devices has made the development of new package materials essential. This is why Shinko Electric is developing materials with superior thermal and electrical characteristics. These include high temperature polymers, low firing temperature ceramics, aluminum nitride, and electronic organic materials.

Analysis Evaluation

To fully use a material, technologies that accurately analyze and evaluate it are essential. Shinko Electric's explorations of the microcosmic world are supported with an extensive array of the latest instrumentation, including Auger electron spectroscope, EPMA, X-ray diffraction equipment, and chromatography systems. For evaluation of electrical characteristics, its labs are equipped with network analyzers and thermal resistance measurement instrumentation for evaluation of thermal characteristics.

Thermal and Electrical Characteristic Analysis Evaluation

As IC's become faster and attain higher levels of integration, packages are faced with more stringent demands for better thermal radiation and lower inductance. Data gained from simulation and evaluation of device heat generation and intra-package heat transfer, along the host of other unique evaluation routines, is analyzed and fed back to the design stage to optimize package materials and design.