Components

The Opto-Electronics package responds to high-speed and mass data transfer in the broadband age. Glass-to-Metal Seals feature hermeticity and superior electrical characteristics that are widely used in such fields as semiconductor lasers and sensors for cars, which require high reliability. In addition, Premold Packages, Contract Parts, and Ceramic Surge Arresters are available.

Shinko Electric Industries is also entrusted with manufacturing advanced semiconductor devices using internally designed and manufactured products. It supplies Flip Chip Packages featuring high speed and compactness, and System Modules equipped with multiple IC Chips and passive parts. The most advanced Wafer Level Package is a real chip-size package developed to meet the compactness required for semiconductor devices.