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Singapore, January 12, 2012 – Fujitsu Components Asia Pte. Ltd. has expanded its mobile thermal printer offering with a 2-inch receipt unit that is compatible with Apple® iOS, as well as Android™ and BlackBerry® operating systems.
Singapore, January 12, 2012 – Fujitsu Components Asia Pte. Ltd. has enhanced its FP-510 standalone thermal printer series with an ultra-high print speed and expanded functions to improve throughput efficiency and reduce wait times for receipt, ticket and label printing.
Singapore, November 10, 2011 – Fujitsu Components Asia Pte., Ltd., announced today it has added a compact, 802.11b/g wireless LAN + Bluetooth® version 2.1+EDR (Enhanced Data Rate) combination module. The fully integrated module minimizes piece parts while providing engineers with a cost-effective way to easily and quickly add both wireless technologies to new product designs without requiring special expertise.
Singapore, April 25, 2011 – Fujitsu Components Asia Pte. Ltd. has released a new medium duty, ultra-compact thermal printer unit that can be easily configured for a variety of kiosk, ATM, receipt, label or ticket issuing applications.
Singapore, April 25, 2011 – Fujitsu Components Asia Pte. Ltd. has released a new medium duty, ultra-compact thermal printer unit that can be easily configured for a variety of kiosk, ATM, receipt, label or ticket issuing applications.
Singapore, November 30, 2010 – Fujitsu Components Asia Pte. Ltd. today introduced a wireless module with USB 2.0 interface that provides full-featured 802.11 b/g/n Wireless Local Area Network (WLAN) capabilities in a very small form factor.
Singapore, November 22, 2010 – Fujitsu Components Asia Pte. Ltd. today announced the addition of its Windows® 7-certified, resistive multi-input touch panels to its standard product offering for Asia. This off-the-shelf accessibility allows designers to add multi-touch capability to industrial, medical and other embedded applications with much shorter lead times.
Singapore, August 3, 2010 – Fujitsu Components Asia Pte. Ltd. today released a DDR3 (Double Data Rate) DIMM (Dual Inline Memory Module) socket connector designed to reduce errors and intermittent faults associated with DDR3 memory modules.
Singapore, May 24, 2010 – Fujitsu Components Asia Pte. Ltd. the first manufacturer to obtain Windows® 7 logo certification for a resistive multi-input touch panel, is now marketing those touch panels in Asia. Already in production in Japan since August 2009, the new multi-input panels’ increased functionality promises to expand touch capability into many new applications and markets, including harsh environments.
Singapore, May 17, 2010 – Fujitsu Components Asia Pte. Ltd. today released a durable, Film-Film resistive touch panel series targeting mobile applications. The plastic touch panels are 30-40% lighter than Film-Glass panels, withstand greater input loads, and have 2x the life of typical Film-Film panels.
Singapore, May 13, 2010 – Fujitsu Components Asia Pte. Ltd. today announced it is offering its self-wetting adhesive protector sheets (SWAPS) in standard sizes to fit popular LCD dimensions. The protector sheets offer a low-cost, readily available way to extend the life of any touch screen or flat panel during product use, testing or shipping.
Singapore, April 15, 2010 – Fujitsu Components Asia Pte. Ltd. today added an ultra high-speed, compact, 3-inch thermal printer mechanism for embedded OEM designs. The new printer enhances throughput in applications that demand fast and reliable ticket and label output, such as kiosks, label and ticket-issuing machines, and medical instrumentation.
Singapore, April 14, 2010 – Fujitsu Components Asia Pte. Ltd. today expanded its thermal printer offering with the release of a high-speed, three-inch receipt printer unit for compact, self-service devices and kiosks. This new printer unit has features that accelerate transaction times while providing long-term reliability, durability and drop-in design integration.
Singapore, February 23, 2010 – Fujitsu Components Asia Limited today announced that it is marketing a diverse range of wireless modules in North America to address core OEM design needs as the market for wireless mobile devices, portable media devices and industrial equipment steadily increases. Fujitsu brings innovation from many years of industry-leading Multi-Chip Module design and production experience, resulting in smaller wireless module package sizes that consume less power than competing products.
Singapore, July 10, 2009 – Fujitsu Components Asia Limited today introduced a vertical, surface-mount DDR2 (double data rate) DIMM (dual in-line memory module) socket connector with an enhanced contact design and 0.1mm lead coplanarity.