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May 2002
- 24 May 2002 Singapore
- Fujitsu Introduces New High-Performance 8-bit Microcontroller for Digital Appliances
Singapore, May 24, 2002 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the introduction of its new 8-bit microcontroller, the MB89F538L, which includes 48 Kbytes of flash memory and comes in a compact 0.8 mm-high BCC-64 package with a 9 x 9 mm footprint. Developed jointly with Kyushu Fujitsu Electronics Ltd., the new product is ideal for use as a sub-controller in digital appliances, such as digital cameras and DVD recorders. It is the newest addition to the F 2MC-8L family of 8-bit microcontrollers, all of which feature a wide choice of on-chip functions and peripheral blocks.
- 22 May 2002 Singapore
- Fujitsu Achieves 90% Transmissivity with New Resistive Touch Panel Series
Singapore, May 22, 2002 – Fujitsu Components Asia, Limited (FCAL) today announced it has started production of 90% transparent, resistive-film touch panels. This very high level of transmissivity provides improved contrast and color clarity, and greater image readability in high ambient light.
- 20 May 2002 Singapore
- Fujitsu Releases Resistive Touch Panel Line with 85% Transmissivity
Singapore, May 20, 2002 – Fujitsu Components Asia, Limited (FCAL) today introduced a new series of resistive-film touch panels with 85% transparency for LCD applications.
- 16 May 2002 Singapore
- Fujitsu Introduces New Line of High-Performance 32-bit RISC Microcontrollers with CAN Interface for Automotive Meter Control
Singapore, May 16, 2002 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced that Fujitsu Japan has jointly developed with Fujitsu Microelectronics Europe a new group of offerings in its FR Series of microcontrollers featuring the company's 32-bit RISC core and built-in Controller Area Network (CAN) interface for optimizing high-speed real-time control in automotive metering systems. The MB91360G Series, which will be commercially available beginning today, includes six models suited to varied requirements for packaging and functionality.
