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  5. Fujitsu Semiconductor and Tera Probe Announce the Establishment of a Joint Venture for Wafer Tests

PRESS RELEASE

17 September, 2015
Fujitsu Semiconductor Limited
Tera Probe, Inc.

Fujitsu Semiconductor and Tera Probe Announce the Establishment of a Joint Venture for Wafer Tests

Yokohama, Japan, September 17, 2015 – Fujitsu Semiconductor Ltd. and Tera Probe, Inc. today announced that Fujitsu Semiconductor's subsidiary Aizu Fujitsu Semiconductor Ltd. and Tera Probe have officially signed a contract to establish a joint venture for the wafer test business, Aizu Fujitsu Semiconductor Probe Ltd. (provisional title).

Aizu Fujitsu Semiconductor Wafer Solution Ltd., a subsidiary of Aizu Fujitsu Semiconductor, is doing its 150 mm wafer foundry business and its 150 mm and 200 mm wafer test business, which offer high quality and low-volume high-mix support. For its part, Tera Probe offers a low-cost, high quality test service using world-class technology. For many years, the Fujitsu Semiconductor Group has built a strong business relationship with Tera Probe through wafer test outsourcing. Now, Aizu Fujitsu Semiconductor and Tera Probe have agreed to enter into a joint venture, with the goals of strengthening their partnership and further expanding their business.

The new company will take control of Aizu Fujitsu Semiconductor Wafer Solution's wafer test business, with Tera Probe acquiring shares in the new company (an equity ratio of 65% for Aizu Fujitsu Semiconductor, 35% for Tera Probe). They plan to finish the necessary formalities and begin operations in the fourth quarter of fiscal 2015.

Transfering the wafer test business to the new company


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Company and product names mentioned herein are trademarks or registered trademarks of their respective companies. Information provided in this press release is accurate at time of publication and subject to change without advance notice.

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