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FUJITSU FRAM Quality & Reliability

Reliability(4/4)


Results of product reliability tests

Results of reliability tests on product units are shown in Tables 5 and 6.

Table 5. Endurance tests

Test item Test condition Test hours No. of tests No. of failed units
High Temperature Storage Ta=150°C 1kh 46 0
High Temperature Operating Life Ta=125°C 1kh 77 0
Temperature Humidity Bias Ta=85°C, 85%RH 1kh 46 0
Low Temperature Operating Life Ta=-55°C 1kh 26 0

Notes:

High Temperature Operating Life : No. of tests
Temperature Humidity Bias : No. of tests

  • Pre-treatment : Baking (125°C, 24h) + (Moisture Absorption (85°C/85%RH, 12h) + IR Reflow 240°C MAX.) x 2 times  

High Temperature Operating Life
Temperature Humidity Bias
Low Temperature Operating Life

  • Conditions for operation with alternative currents: power supply voltage of 6.0 V, input frequency of 1 MHz

Table 6. Environmental tests

Test item Test condition No. of tests No. of failed units
Temperature Cycling Ta=-65°C-150°C (200cyc) 1 8 0
Thermal Shock Ta=0°C-100°C (200cyc) 1 11 0
Pressure Cooker Test Ta=121°C, 100%RH: 2.03 x  10EXP5 Pa (168h) 18 0
Pressure Cooker Test with Bias Ta=121°C, 100%RH: 2.03 x  10EXP5  Pa (96h) 11 0

Notes:

Temperature Cycling : No. of tests
Pressure Cooker Test : No. of tests

  • Pre-treatment : Baking (125°C, 24h) + (Moisture Absorption (85°C/85%RH, 12h) + IR Reflow 240°C MAX.) x 2 times  

Pressure Cooker Test with Bias

  • Pressure Cooker Test with Bias operating conditions: power supply voltage of 6.0 V