Overview | SOP/TSSOP | QFP/LQFP/HQFP | FBGA | PBGA | TEBGA | FC-BGA | WL-CSP |
Packages
Features
Ultra compact, ultra thin, multi-pin, and superior humidity and reflow resistance by wafer through-hole interconnections.
- Ultra compact, ultra thin, and light weight suitable for mobile devices and digital electric household appliances.
- Superior humidity and reflow resistance with JEDEC Level 1 standard.
- Support for pin pitch at less than 0.4mm contributing towards multi-pin.
- High speed transmission by reducing the wire length.
- Fully customizable according to the customer's requirements.
WL-CSP External view
WL-CSP Processes
WL-CSP Package cross section
WL-CSP Road map
| FY | 2008 | 2009 | 2010 | |
|---|---|---|---|---|
| WL-CSP Structure |
(BGA/LGA) |
 |
||
| Height(Min) | 0.30 mm | ← | 0.25 mm | |
| Ball/Land pitch(Min) | 0.30 mm | ← | 0.25 mm | |
| Ball/Land dia.(Min) | 0.15 mm | ← | 0.13 mm | |
| RDL Technology |
Line/Space | 15µm/20µm | 15µm/15µm | 10µm/15µm |
| Via/Land Pitch(Inline) | 50µm | ← | 40µm | |
| Others | Wafer size | 150/200/300mm (6/8/12inch) |
← | ← |
| Scribe Width (Min) 6/8 in 12 in |
90µm | ← | ← | |
| 90µm (<=0.35-t) | ← | ← | ||
| 100µm (>0.35-t) | ← | ← | ||
| Solder | Pb Free | ← | ← | |
| Mold resin | Halogen Free | ← | ← | |
WL-CSP Mass-production results
| WL-CSP | WLP195 | WLP309 | WLP42 | WLP70-01 | WLP70-02 | WLP108 |
|---|---|---|---|---|---|---|
| Wafer Size | 200 mm | 200 mm | 300 mm | 300 mm | 300 mm | 300 mm |
| Package Size | 5.97×5.97 mm | 7.56×7.56 mm | 3.30×2.95 mm | 3.408×4.486 mm | 3.408×4.486 mm | 5.06×4.46 mm |
| Package Height | 0.8mm Max | 0.8mm Max | 0.49mm Max | 0.49mm Max | 0.35mm Max | 0.6mm Max |
| Chip Thickness | 500µm TYP | 520µm TYP | 300µm TYP | 300µm TYP | 220µm TYP | 350µm TYP |
| Encapsulant Thickness |
70µm TYP | 50µm TYP | 50µm TYP | 50µm TYP | 50µm TYP | 50µm TYP |
| Ball Pitch | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm |
| Ball Height | 130µm TYP | 130µm TYP | 100µm TYP | 100µm TYP | 100µm TYP | 150µm TYP |
