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Packages

WL-CSP(Wafer Level CSP)

Features

Ultra compact, ultra thin, multi-pin, and superior humidity and reflow resistance by wafer consistent assembly.

  • Ultra compact, ultra thin, and light weight suitable for mobile devices and digital electric household appliances.
  • JEDEC Moisture Sensitivity Level 1 clear.
  • Support for pin pitch at less than or equal to 0.5mm contributing towards multi-pin.
  • High speed transmission by reducing the wire length.
  • Compliant with JEITA standards and fully customizable according to customer needs.

WL-CSP External view

WL-CSP Processes

WL-CSP Package cross section

WL-CSP Technology Road map

2010 2011 2012
WL-CSP
Structure 		Height(Min) 0.25 mm ← ←
Ball/Land pitch(Min) 0.30 mm ← 0.25 mm
Ball/Land dia.(Min) 0.15 mm ← 0.13 mm
RDL
Technology 		Line/Space 20µm/15µm ← 15µm/15µm
Via/Land Pitch(Inline) 50µm ← 40µm
Others Wafer size 6/8/12inch ← ←
Scribe Width
(Min) 6/8 in
      12 in 		90µm ← ←
90µm (<=0.35-t) ← ←
100µm (>0.35-t) ← ←
Solder Pb Free ← ←
Mold resin Halogen Free ← ←

WL-CSP Mass-production actual performance

WL-CSP WLP112 WLP309 WLP15 WLP42 WLP70-02 WLP143
Wafer Size 200 mm 200 mm 200 mm 300 mm 300 mm 300 mm
Package Size 6.46 × 6.46 mm 7.56 × 7.56 mm 1.77 × 1.77 mm 3.30 × 2.95 mm 3.408 × 4.486 mm 7.81 × 6.10 mm
Package Height 0.6mm Max 0.8mm Max 0.64mm Max 0.50mm Max 0.35mm Max 0.55mm Max
Chip Thickness 390µm TYP 520µm TYP 390µm TYP 300µm TYP 220µm TYP 350µm TYP
Encapsulant
Thickness 		50µm TYP 50µm TYP 50µm TYP 50µm TYP 50µm TYP 50µm TYP
Ball Pitch 0.5 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.5 mm
Ball Height 110µm TYP 150µm TYP 150µm TYP 100µm TYP 100µm TYP 100µm TYP

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