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Overview | SOP/TSSOP | QFP/LQFP/TEQFP/HQFP | SON/QFN | FBGA | PBGA | TEBGA | FC-BGA | WL-CSP | Bump on Pad |
Packages
Features
- Superior thermal characteristics.
- Superior support for multi-pin.
- Package sizes at 27mmSQ and 35mmSQ are available.
TEBGA Package external view
TEBGA Package cross section
TEBGA Package line-up
| Package code | Pin count | Package size (mm) | Pin arrangement | Pin pitch (mm) | ||
|---|---|---|---|---|---|---|
| Total | number of TBs* included | X | Y | |||
| BGA-320P-Mxx | 320 | 64 | 27.0 | 27.0 | 4 rows | 1.27 |
| BGA-416P-Mxx | 416 | 64 | 27.0 | 27.0 | 4 rows | 1.00 |
| BGA-416P-M06 | 416 | 64 | 35.0 | 35.0 | 4 rows | 1.27 |
| BGA-480P-Mxx | 480 | 64 | 27.0 | 27.0 | 5 rows | 1.00 |
| BGA-484P-M09 | 484 | 64 | 27.0 | 27.0 | 5 rows | 1.00 |
| BGA-484P-M08 | 484 | 64 | 35.0 | 35.0 | 5 rows | 1.27 |
| BGA-520P-Mxx | 520 | 100 | 35.0 | 35.0 | 5 rows | 1.27 |
| BGA-543P-M01 | 543 | 64 | 27.0 | 27.0 | 6 rows | 1.00 |
| BGA-544P-M02 | 544 | 64 | 27.0 | 27.0 | 6 rows | 1.00 |
| BGA-676P-M10 | 676 | - | 27.0 | 27.0 | Full Matrix | 1.00 |
| BGA-676P-M12 | 676 | 100 | 35.0 | 35.0 | 5 rows | 1.00 |
| BGA-770P-Mxx | 772 | 100 | 35.0 | 35.0 | 6 rows | 1.00 |
| BGA-808P-M01 | 808 | 144 | 35.0 | 35.0 | 5 + 2 rows (With nonexistent pins) |
1.00 |
| BGA-868P-M01 | 868 | 196 | 35.0 | 35.0 | 6 rows | 1.00 |
| BGA-900P-M08 | 900 | 144 | 35.0 | 35.0 | 7 rows | 1.00 |
| BGA-1156P-M11 | 1156 | - | 35.0 | 35.0 | Full Matrix | 1.00 |
*TB : Thermal Ball
Please contact us for information on other pin arrangements.
