Overview | SOP/TSSOP | QFP/LQFP/HQFP | FBGA | PBGA | TEBGA | FC-BGA | WL-CSP |
Packages
Features
- Superior cost performance with a mature technology.
- High reliability in mounting the package on printed circuit boards.
- Thin and compact.
SOP and TSSOP Package external view
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| SOP | TSSOP |
SOP and TSSOP Package cross section
SOP and TSSOP Package line-up
| Package type | Package size (mm) | Mounting height (mm) | Pin count | |||
|---|---|---|---|---|---|---|
| X | Y | Pin pitch 1.27mm | Pin pitch 0.65mm | Pin pitch 0.50mm | ||
| SOP | 5.3 | 5.24 | 2.10 Max. | 8 | - | - |
| 7.5 | 12.7 | 2.65 Max. | 20 | - | - | |
| TSSOP | 4.4 | 3.1 | 1.20 Max. | - | 8 | - |
| 4.4 | 4.96 | - | 14/16 | - | ||
| 4.4 | 6.5 | - | 20 | 24 | ||
| 4.4 | 7.8 | - | 24 | 30 | ||
| 4.4 | 9.7 | - | 28 | - | ||
Please contact us for information on other packages.
