Overview | SOP/TSSOP | QFP/LQFP/HQFP | FBGA | PBGA | TEBGA | FC-BGA | WL-CSP |
Packages
Features
- Equipped with outer leads at the four corners of the package.
- Superior cost performance with a mature technology.
- High reliability in mounting the package on printed circuit boards.
- HQFP can be mounted with a chip with high heat emission because of its high efficiency in heat dissipation.
QFP Package external view
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| LQFP | HQFP |
QFP and LQFP Package cross section
HQFP Package cross section
QFP Packages line-up
| Package type | Package size (mm) | Package size (mm) | Pin count | |||
|---|---|---|---|---|---|---|
| X | Y | Pin pitch 0.65mm | Pin pitch 0.50mm | Pin pitch 0.40mm | ||
| QFP | 14.0 | 20.0 | 3.35 Max. | 100 | - | - |
| 28.0 | 28.0 | 3.95 Max. | - | 208 | - | |
| 4.03 Max. | - | - | 256 | |||
| 32.0 | 32.0 | - | 240 | - | ||
| LQFP | 7.0 | 7.0 | 1.70 Max. | - | 48 | 64 |
| 10.0 | 10.0 | 52 | 64 | - | ||
| 12.0 | 12.0 | 64 | 80 | - | ||
| 14.0 | 14.0 | 80 | 100 | 120 | ||
| 16.0 | 16.0 | - | 120 | 144 | ||
| 20.0 | 20.0 | - | 144 | - | ||
| 24.0 | 24.0 | - | 176 | 216 | ||
| 28.0 | 28.0 | - | 208 | 256 | ||
| HQFP | 28.0 | 28.0 | 3.95 Max. | - | 208 | - |
| 4.03 Max. | - | - | 256 | |||
| 32.0 | 32.0 | - | 240 | 296 | ||
| 40.0 | 40.0 | 4.10 Max. | - | 304 | - | |
Please contact us for information on other packages.
