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Overview | SOP/TSSOP | QFP/LQFP/TEQFP/HQFP | SON/QFN | FBGA | PBGA | TEBGA | FC-BGA | WL-CSP | Bump on Pad |
Packages
Features
- Sealed with plastic resin to achieve high cost performance.
- Superior support for multi-pin.
- Package sizes at 27mmSQ, 31mmSQ, and 35mmSQ are available.
PBGA Package external view
PBGA Package cross section
PBGA Package line-up
| Package code | Pin count | Package size (mm) | Pin arrangement | Pin pitch (mm) | ||
|---|---|---|---|---|---|---|
| Total | number of TBs* included | X | Y | |||
| BGA-256P-M24 | 256 | - | 17.0 | 17.0 | Full Matrix | 1.00 |
| BGA-256P-M27 | 256 | 0 | 27.0 | 27.0 | 4 rows | 1.27 |
| BGA-320P-M06 | 320 | 64 | 27.0 | 27.0 | 4 rows | 1.27 |
| BGA-321P-M02 | 321 | - | 19.0 | 19.0 | Full Matrix (With nonexistent pins) |
1.00 |
| BGA-353P-M02 | 353 | 49 | 31.0 | 31.0 | 4 rows | 1.27 |
| BGA-416P-M05 | 416 | 64 | 27.0 | 27.0 | 4 rows | 1.00 |
| BGA-416P-M09 | 416 | 64 | 35.0 | 35.0 | 4 rows | 1.27 |
| BGA-480P-M14 | 480 | 64 | 27.0 | 27.0 | 5 rows | 1.00 |
| BGA-484P-M07 | 484 | 64 | 27.0 | 27.0 | 5 rows | 1.00 |
| BGA-484P-M11 | 484 | 64 | 35.0 | 35.0 | 5 rows | 1.27 |
| BGA-493P-M01 | 493 | 64 | 27.0 | 27.0 | 3 + (2) + 3 rows (With nonexistent pins) |
1.00 |
| BGA-496P-M02 | 496 | 144 | 27.0 | 27.0 | 4 rows | 1.00 |
| BGA-544P-M04 | 544 | 64 | 27.0 | 27.0 | 6 rows | 1.00 |
| BGA-564P-M01 | 564 | 64 | 31.0 | 31.0 | 5 rows | 1.00 |
| BGA-676P-M06 | 676 | - | 27.0 | 27.0 | Full Matrix | 1.00 |
| BGA-676P-M14 | 676 | 100 | 35.0 | 35.0 | 5 rows | 1.00 |
| BGA-868P-M03 | 868 | 196 | 35.0 | 35.0 | 6 rows | 1.00 |
| BGA-900P-M14 | 900 | - | 31.0 | 31.0 | Full Matrix | 1.00 |
*TB : Thermal Ball
Please contact us for information on other pin arrangements.
