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Packages

FC-BGA(Flip Chip Ball Grid Array)

Features

Superior electrical and thermal performance thanks to the flip chip bonding technology.
Wide support from consumer appliances to high-end.

  • Support for ultra multi-pin by arranging the chip electrode over an area.
  • Good dissipation of heat produced from the high electric consumption chip by deployment of a heat spreader.
  • Capable of reduction of waveform distortion and high speed transmission (GHz level) for high frequencies.
  • Fully customizable according to the customer's requirements.

FC-BGA Package external view

FC-PBGA Package cross section

FC-CBGA Package cross section

Multi-pin BGA Package road map

Fujitsu Microelectronics will provide the most suitable SiP to the customer's requirements with our extensive implementation technologies.
Please do not hesitate to contact us.

FC-BGA Package line-up

FC-PBGA

Pin count Package size (mm) Pin arrangement Ball matrix Pin pitch (mm)
X Y
400 21.0 21.0 Full Matrix 20 × 20 1.00
484 23.0 23.0 Full Matrix 22 × 22 1.00
625 17.0 17.0 Full Matrix 25 × 25 0.65
625 27.0 27.0 Full Matrix 25 × 25 1.00
729 29.0 29.0 Full Matrix 27 × 27 1.00
900 31.0 31.0 Full Matrix 30 × 30 1.00
1020 33.0 33.0 Full Matrix 32 × 32 1.00
1156 35.0 35.0 Full Matrix 34 × 34 1.00
1396 37.5 37.5 Full Matrix 37 × 37 1.00
1681 42.5 42.5 Full Matrix 41 × 41 1.00

FC-CBGA

Pin count Package size (mm) Pin arrangement Ball matrix Pin pitch (mm)
X Y
625 27.0 27.0 Full Matrix 25 × 25 1.00
625 33.0 33.0 Full Matrix 25 × 25 1.27
728 35.0 35.0 Full Matrix 27 × 27 1.27
900 31.0 31.0 Full Matrix 30 × 30 1.00
900 40.0 40.0 Full Matrix 30 × 30 1.27
1089 42.5 42.5 Full Matrix 33 × 33 1.27
1156 35.0 35.0 Full Matrix 34 × 34 1.00
1225 45.0 45.0 Full Matrix 35 × 35 1.27
1369 37.5 37.5 Full Matrix 37 × 37 1.00
1681 42.5 42.5 Full Matrix 41 × 41 1.00
2116 47.5 47.5 Full Matrix 46 × 46 1.00

Please contact us for information on other packages.