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Overview | SOP/TSSOP | QFP/LQFP/TEQFP/HQFP | SON/QFN | FBGA | PBGA | TEBGA | FC-BGA | WL-CSP | Bump on Pad |
Packages
Features
Superior electrical and thermal performance thanks to the flip chip bonding technology.
Wide support from consumer appliances to high-end applications including servers.
- Support for ultra multi-pin by arranging the chip electrode over an area.
- Good dissipation of heat produced from the high electric consumption chip by deployment of a heat spreader.
- Capable of reduction of waveform distortion and high speed transmission (GHz level) for high frequencies.
- Fully customizable according to the customer's requirements.
FC-BGA Package external view
FC-PBGA Package cross section
FC-CBGA Package cross section
Middle to High-end Package Road map
Fujitsu Semiconductor will provide the most suitable SiP to the customer's requirements with our extensive implementation technologies.
Please contact us for any requests.
FC-BGA Package line-up
FC-PBGA
| Pin count | Package size (mm) | Pin arrangement | Ball matrix | Pin pitch (mm) | |
|---|---|---|---|---|---|
| X | Y | ||||
| BGA484 | 23.0 | 23.0 | Full Matrix | 22 × 22 | 1.00 |
| BGA592 | 21.0 | 21.0 | Full Matrix (With nonexistent pins) |
25 × 25 | 0.80 |
| BGA625 | 17.0 | 17.0 | Full Matrix | 25 × 25 | 0.65 |
| BGA625 | 27.0 | 27.0 | Full Matrix | 25 × 25 | 1.00 |
| BGA729 | 29.0 | 29.0 | Full Matrix | 27 × 27 | 1.00 |
| BGA900 | 31.0 | 31.0 | Full Matrix | 30 × 30 | 1.00 |
| BGA1020 | 33.0 | 33.0 | Full Matrix | 32 × 32 | 1.00 |
| BGA1156 | 35.0 | 35.0 | Full Matrix | 34 × 34 | 1.00 |
| BGA1206 | 37.5 | 37.5 | Full Matrix (With nonexistent pins) |
36 × 36 | 1.00 |
| BGA1396 | 37.5 | 37.5 | Full Matrix | 37 × 37 | 1.00 |
| BGA1681 | 42.5 | 42.5 | Full Matrix | 41 × 41 | 1.00 |
FC-CBGA
| Pin count | Package size (mm) | Pin arrangement | Ball matrix | Pin pitch (mm) | |
|---|---|---|---|---|---|
| X | Y | ||||
| BGA625 | 27.0 | 27.0 | Full Matrix | 25 × 25 | 1.00 |
| BGA625 | 33.0 | 33.0 | Full Matrix | 25 × 25 | 1.27 |
| BGA729 | 35.0 | 35.0 | Full Matrix | 27 × 27 | 1.27 |
| BGA900 | 31.0 | 31.0 | Full Matrix | 30 × 30 | 1.00 |
| BGA900 | 40.0 | 40.0 | Full Matrix | 30 × 30 | 1.27 |
| BGA1089 | 42.5 | 42.5 | Full Matrix | 33 × 33 | 1.27 |
| BGA1156 | 35.0 | 35.0 | Full Matrix | 34 × 34 | 1.00 |
| BGA1225 | 45.0 | 45.0 | Full Matrix | 35 × 35 | 1.27 |
| BGA1369 | 37.5 | 37.5 | Full Matrix | 37 × 37 | 1.00 |
| BGA1681 | 42.5 | 42.5 | Full Matrix | 41 × 41 | 1.00 |
| BGA2116 | 47.5 | 47.5 | Full Matrix | 46 × 46 | 1.00 |
Please contact us for information on other pin arrangements.
