Overview | SOP/TSSOP | QFP/LQFP/HQFP | FBGA | PBGA | TEBGA | FC-BGA | WL-CSP |
Packages
Features
Low profile and multi-pin support, suitable for portable devices such as mobile phones and DSCs.
- Fine pitch (pin pitch from 0.4mm) and thin.
- Superior electrical characteristics and reliability.
- Plentiful line-up and customization support.
FBGA Package external view
FBGA Package cross section
FBGA Road map
Fujitsu Microelectronics will provide the most suitable SiP to the customer's requirements with our extensive implementation
technologies.
Please do not hesitate to contact us.
FBGA Package line-up
Pin pitch : 0.50mm
| Pin count | Package size (mm) | Pin arrangement | Package code | |
|---|---|---|---|---|
| X | Y | |||
| 82 (IO73+TB9) | 6.0 | 6.0 | 2 rows | BGA-82P-M01 |
| 96 (IO96) | 6.0 | 6.0 | 3 rows | BGA-96P-M04 |
| 100 (IO100) | 7.0 | 7.0 | 2 + (1) + 1 rows | BGA-100P-M03 |
| 112 (IO112) | 7.0 | 7.0 | 3 rows (With nonexistent pins) |
BGA-112P-M05 |
| 232 (IO232) | 12.0 | 12.0 | 2 + (1) + 2 rows | BGA-232P-M01 |
| 240 (IO240+TB49) | 10.0 | 10.0 | 4 rows | BGA-240P-M02 |
| 240 (IO240+TB0) | 10.0 | 10.0 | 4 rows | BGA-240P-M03 |
| 289 (IO264+TB25) | 10.0 | 10.0 | 3 + (1) + 2 rows | BGA-289P-M01 |
| 304 (IO304) | 13.0 | 13.0 | 2 + (1) + 2 rows | BGA-304P-M05 |
| 304 (IO304) | 12.0 | 12.0 | 4 rows | BGA-304P-M07 |
| 337 (IO337+TB81) | 13.0 | 13.0 | 4 rows | BGA-337P-M02 |
| 385 (IO385+TB49) | 13.0 | 13.0 | 3 + (1) + 2 rows | BGA-385P-M01 |
| 385 (IO304+TB81) | 13.0 | 13.0 | 2 + (2) + 2 rows | BGA-385P-M02 |
| 385 (IO304+TB81) | 12.0 | 12.0 | 4 rows | BGA-385P-M03 |
| 400 (IO400+TB81) | 15.0 | 15.0 | 4 rows | BGA-400P-M04 |
| 586 (IO537+TB49) | 15.0 | 15.0 | 4 + (1) + 2 rows | BGA-586P-M04 |
| 610 (IO489+TB121) | 16.0 | 16.0 | 3 + (2) + 2 rows | BGA-610P-M01 |
| 650 (IO481+TB169) | 15.0 | 15.0 | 5 rows | BGA-650P-M03 |
| 753 (IO584+TB169) | 18.0 | 18.0 | 3 + (1) + 2 rows | BGA-753P-M01 |
*TB : Thermal Ball
Pin pitch : 0.65mm
| Pin count | Package size (mm) | Pin arrangement | Package code | |
|---|---|---|---|---|
| X | Y | |||
| 176 (IO176) | 11.0 | 11.0 | 4 rows | BGA-176P-M05 |
| 204 (IO204) | 11.0 | 11.0 | 3 + (1) + 2 rows | BGA-204P-M01 |
| 360 (IO360+TB81) | 16.0 | 16.0 | 5 rows | BGA-360P-M05 |
| 385 (IO360+TB25) | 16.0 | 16.0 | 5 rows | BGA-385P-M04 |
*TB : Thermal Ball
Pin pitch : 0.80mm
| Pin count | Package size (mm) | Pin arrangement | Package code | |
|---|---|---|---|---|
| X | Y | |||
| 112 (IO112) | 10.0 | 10.0 | 4 rows | BGA-112P-M04 |
| 144 (IO144) | 12.0 | 12.0 | 4 rows | BGA-144P-M06 |
| 144 (IO144) | 12.0 | 12.0 | 4 rows (With nonexistent pins) |
BGA-144P-M07 |
| 176 (IO176) | 12.0 | 12.0 | 5 rows (With nonexistent pins) |
BGA-176P-M04 |
| 192 (IO192) | 12.0 | 12.0 | Full Matrix (With nonexistent pins) |
BGA-192P-M06 |
| 224 (IO224) | 16.0 | 16.0 | 4 rows | BGA-224P-M06 |
| 224 (IO224+TB36) | 16.0 | 16.0 | 4 rows | BGA-224P-M08 |
| 224 (IO224+TB64) | 16.0 | 16.0 | 4 rows | BGA-224P-M09 |
| 240 (IO240) | 15.0 | 15.0 | 5 rows | BGA-240P-M06 |
| 256 (IO207+TB49) | 18.0 | 18.0 | 2 + (1) + 2 rows | BGA-256P-M17 |
| 272 (IO272+TB49) | 18.0 | 18.0 | 4 rows | BGA-272P-M06 |
| 272 (IO272) | 18.0 | 18.0 | 4 rows | BGA-272P-M08 |
| 320 (IO320+TB49) | 18.0 | 18.0 | 5 rows | BGA-320P-M05 |
| 441 (IO441) | 18.0 | 18.0 | Full Matrix | BGA-441P-M01 |
*TB : Thermal Ball
Please contact us for information on other packages.
