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Overview | SOP/TSSOP | QFP/LQFP/TEQFP/HQFP | SON/QFN | FBGA | PBGA | TEBGA | FC-BGA | WL-CSP | Bump on Pad |
Packages
Features
Low profile and multi-pin support, suitable for portable devices such as mobile phones and DSCs.
- Fine pitch (pin pitch from 0.4mm) and thin.
- Superior electrical characteristics and reliability.
- Plentiful line-up and customization support.
FBGA Package external view
FBGA Package cross section
CSP Road map
Fujitsu Semiconductor will provide the most suitable SiP to the customer's requirements with our extensive implementation technologies.
Please do not hesitate to contact us.
Module Package Road map
FBGA Package line-up
Pin pitch : 0.5mm (Less than 500pin)
| Package code | Pin count | Package size (mm) | Pin arrangement | ||
|---|---|---|---|---|---|
| Total | number of TBs* included | X | Y | ||
| BGA-66P-M01 | 66 | 9 | 5.0 | 5.0 | 2 rows |
| BGA-82P-M01 | 82 | 9 | 6.0 | 6.0 | 2 rows |
| BGA-96P-M04 | 96 | 0 | 6.0 | 6.0 | 3 rows |
| BGA-100P-M03 | 100 | 0 | 7.0 | 7.0 | 2 + (1) + 1 rows |
| BGA-112P-M05 | 112 | 0 | 7.0 | 7.0 | 3 rows (With nonexistent pins) |
| BGA-130P-M02 | 130 | 9 | 7.0 | 7.0 | 3 rows |
| BGA-144P-M09 | 144 | 0 | 7.0 | 7.0 | 4 rows |
| BGA-168P-M03 | 168 | 25 | 9.0 | 9.0 | 3 rows (With nonexistent pins) |
| BGA-208P-M01 | 208 | 0 | 9.0 | 9.0 | 4 rows |
| BGA-232P-M01 | 232 | 0 | 12.0 | 12.0 | 2 + (1) + 2 rows |
| BGA-240P-M02 | 289 | 49 | 10.0 | 10.0 | 4 rows |
| BGA-240P-M03 | 240 | 0 | 10.0 | 10.0 | 4 rows |
| BGA-289P-M01 | 289 | 25 | 10.0 | 10.0 | 3 + (1) + 2 rows |
| BGA-304P-M05 | 304 | 0 | 13.0 | 13.0 | 2 + (1) + 2 rows |
| BGA-304P-M07 | 304 | 0 | 12.0 | 12.0 | 4 rows |
| BGA-337P-M02 | 428 | 81 | 13.0 | 13.0 | 4 rows |
| BGA-345P-Mxx | 345 | 25 | 12.0 | 12.0 | 2 + (1) + 2 + (1) + 1 rows |
| BGA-385P-M01 | 434 | 49 | 13.0 | 13.0 | 3 + (1) + 2 rows |
| BGA-385P-M02 | 385 | 81 | 13.0 | 13.0 | 2 + (2) + 2 rows |
| BGA-385P-M03 | 385 | 81 | 12.0 | 12.0 | 4 rows |
| BGA-400P-M04 | 481 | 81 | 15.0 | 15.0 | 4 rows |
*TB : Thermal Ball
Pin pitch : 0.5mm (500pin or more)
| Package code | Pin count | Package size (mm) | Pin arrangement | ||
|---|---|---|---|---|---|
| Total | number of TBs* included | X | Y | ||
| BGA-506P-Mxx | 506 | 81 | 14.0 | 14.0 | 3 + (1) + 2 rows |
| BGA-562P-M03 | 562 | 81 | 14.0 | 14.0 | 3 + (1) + 3 rows |
| BGA-586P-Mxx | 586 | 121 | 15.0 | 15.0 | 3 + (1) + 2 rows |
| BGA-586P-M04 | 586 | 49 | 15.0 | 15.0 | 4 + (1) + 2 rows |
| BGA-610P-M01 | 610 | 121 | 16.0 | 16.0 | 3 + (2) + 2 rows |
| BGA-650P-M03 | 650 | 169 | 15.0 | 15.0 | 5 rows |
| BGA-753P-Mxx | 753 | 169 | 18.0 | 18.0 | 3 + (1) + 2 rows |
| BGA-770P-M01 | 770 | 121 | 16.0 | 16.0 | 4 + (1) + 3 rows |
| BGA-842P-Mxx | 842 | 169 | 18.0 | 18.0 | 3 + (1) + 2 rows |
| BGA-906P-Mxx | 906 | 169 | 18.0 | 18.0 | 3 + (1) + 2 + (1) + 2 rows |
*TB : Thermal Ball
Pin pitch : 0.65mm
| Package code | Pin count | Package size (mm) | Pin arrangement | ||
|---|---|---|---|---|---|
| Total | number of TBs* included | X | Y | ||
| BGA-176P-M05 | 176 | 0 | 11.0 | 11.0 | 4 rows |
| BGA-204P-M01 | 204 | 0 | 11.0 | 11.0 | 3 + (1) + 2 rows |
| BGA-240P-M07 | 240 | 0 | 13.0 | 13.0 | 4 rows |
| BGA-252P-M01 | 252 | 0 | 13.0 | 13.0 | 5 rows (With nonexistent pins) |
| BGA-280P-M03 | 280 | 0 | 13.0 | 13.0 | 5 rows |
| BGA-360P-M05 | 441 | 81 | 16.0 | 16.0 | 5 rows |
| BGA-385P-M04 | 385 | 25 | 16.0 | 16.0 | 5 rows |
*TB : Thermal Ball
Pin pitch : 0.80mm
| Package code | Pin count | Package size (mm) | Pin arrangement | ||
|---|---|---|---|---|---|
| Total | number of TBs* included | X | Y | ||
| BGA-112P-M04 | 112 | 0 | 10.0 | 10.0 | 4 rows |
| BGA-144P-M06 | 144 | 0 | 12.0 | 12.0 | 4 rows |
| BGA-144P-M07 | 144 | 0 | 12.0 | 12.0 | 4 rows (With nonexistent pins) |
| BGA-176P-M04 | 176 | 0 | 12.0 | 12.0 | 5 rows (With nonexistent pins) |
| BGA-188P-M01 | 188 | 0 | 15.0 | 15.0 | 4 rows (With nonexistent pins) |
| BGA-192P-M06 | 192 | - | 12.0 | 12.0 | Full Matrix (With nonexistent pins) |
| BGA-224P-M06 | 224 | 0 | 16.0 | 16.0 | 4 rows |
| BGA-224P-M08 | 260 | 36 | 16.0 | 16.0 | 4 rows |
| BGA-224P-M09 | 288 | 64 | 16.0 | 16.0 | 4 rows |
| BGA-240P-M06 | 240 | 0 | 15.0 | 15.0 | 5 rows |
| BGA-256P-M17 | 256 | 49 | 18.0 | 18.0 | 2 + (1) + 2 rows |
| BGA-272P-M06 | 321 | 49 | 18.0 | 18.0 | 4 rows |
| BGA-272P-M08 | 272 | 0 | 18.0 | 18.0 | 4 rows |
| BGA-320P-M05 | 369 | 49 | 18.0 | 18.0 | 5 rows |
| BGA-441P-M01 | 441 | - | 18.0 | 18.0 | Full Matrix |
*TB : Thermal Ball
Please contact us for information on other pin arrangements.
