Packages
Electronic products have been in growing demand, such as personal computers, mobile phones and PDAs, and its technology innovation has constantly come along. The IC technology is supporting customers to meet market demands today and in the future.
Packaging solutions enable to reduce size and space requirements as a key technology. The packages such as CSP (Chip Size Package or Chip Scale Package) and BGA (Ball Grid Array) have supported high-density wiring technology and widely used in the market.
Miniaturization forced the use of new approaches in die packaging in order to achieve the smallest possible solutions. Fujitsu Microelectronics has launched the mass-production of SON packages which was impressed as the world's smallest level.
Fujitsu Microelectronics has a mass-production lineup of super compact packages such as FBGA (Fine Pitch BGA) and WL-CSP (Wafer Level CSP) and beyond. The high pin count packages, PBGA (Plastic BGA) and TEBGA (Thermal Enhanced BGA) have been mass-produced in order to fulfill the size and weight limitations, for example portable equipment.
Package Overview
| Package type | Package structure | Pin count | I/O frequency (GHz) |
Heat resistance ja(ºC/W) (0m/s) |
Application | |
|---|---|---|---|---|---|---|
 |
FC-CBGA |  |
450 to 2116 | Max. 5 | Min. 7 | Routers, Servers, Workstations, Backbone transmission devices |
| FC-PBGA |  |
450 to 2116 | Max. 2.5 | Min. 7 | ||
| FC-PBGA |  |
450 to 1156 | Max. 2.5 | Min. 9 | Routers, Personal computers, Graphics, Digital TVs, Set top boxes, Ink-jet printers | |
| TEBGA |  |
256 to 1156 | Max. 1.6 | Min. 13 | ||
| PBGA |  |
256 to 1156 | Max. 1.6 | Min. 15 | ||
 |
||||||
| FBGA |  |
66 to 906 | Max. 1 | 25 to 40 | Personal computers, Mobile phones, Digital video cameras, Digital still cameras, PDAs | |
| WL-CSP |  |
42 to 195 | Min. 2.5 | 25 to 60 | Mobile phones, Digital video cameras, Digital still cameras, PDAs | |
| QFP LQFP |
 |
48 to 304 | Max. 2.5 | 15 to 100 | Personal computers, Digital TV, Set top boxes, Ink-jet printers |
Package Search
Catalogs
- PDF IC Package(5.1MB)
Related Links
- FIND Magazine
Packages
Features
- Superior cost performance with a mature technology.
- High reliability in mounting the package on printed circuit boards.
- Thin and compact.
SOP and TSSOP Package external view
 |
 |
| SOP | TSSOP |
SOP and TSSOP Package cross section
SOP and TSSOP Package line-up
| Package type | Package size (mm) | Mounting height (mm) | Pin count | |||
|---|---|---|---|---|---|---|
| X | Y | Pin pitch 1.27mm | Pin pitch 0.65mm | Pin pitch 0.50mm | ||
| SOP | 5.3 | 5.24 | 2.10 Max. | 8 | - | - |
| 7.5 | 12.7 | 2.65 Max. | 20 | - | - | |
| TSSOP | 4.4 | 3.1 | 1.20 Max. | - | 8 | - |
| 4.4 | 4.96 | - | 14/16 | - | ||
| 4.4 | 6.5 | - | 20 | 24 | ||
| 4.4 | 7.8 | - | 24 | 30 | ||
| 4.4 | 9.7 | - | 28 | - | ||
Please contact us for information on other packages.
Packages
Features
- Equipped with outer leads at the four corners of the package.
- Superior cost performance with a mature technology.
- High reliability in mounting the package on printed circuit boards.
- HQFP can be mounted with a chip with high heat emission because of its high efficiency in heat dissipation.
QFP Package external view
 |
 |
| LQFP | HQFP |
QFP and LQFP Package cross section
HQFP Package cross section
QFP Packages line-up
| Package type | Package size (mm) | Package size (mm) | Pin count | |||
|---|---|---|---|---|---|---|
| X | Y | Pin pitch 0.65mm | Pin pitch 0.50mm | Pin pitch 0.40mm | ||
| QFP | 14.0 | 20.0 | 3.35 Max. | 100 | - | - |
| 28.0 | 28.0 | 3.95 Max. | - | 208 | - | |
| 4.03 Max. | - | - | 256 | |||
| 32.0 | 32.0 | - | 240 | - | ||
| LQFP | 7.0 | 7.0 | 1.70 Max. | - | 48 | 64 |
| 10.0 | 10.0 | 52 | 64 | - | ||
| 12.0 | 12.0 | 64 | 80 | - | ||
| 14.0 | 14.0 | 80 | 100 | 120 | ||
| 16.0 | 16.0 | - | 120 | 144 | ||
| 20.0 | 20.0 | - | 144 | - | ||
| 24.0 | 24.0 | - | 176 | 216 | ||
| 28.0 | 28.0 | - | 208 | 256 | ||
| HQFP | 28.0 | 28.0 | 3.95 Max. | - | 208 | - |
| 4.03 Max. | - | - | 256 | |||
| 32.0 | 32.0 | - | 240 | 296 | ||
| 40.0 | 40.0 | 4.10 Max. | - | 304 | - | |
Please contact us for information on other packages.
Packages
Features
Low profile and multi-pin support, suitable for portable devices such as mobile phones and DSCs.
- Fine pitch (pin pitch from 0.4mm) and thin.
- Superior electrical characteristics and reliability.
- Plentiful line-up and customization support.
FBGA Package external view
FBGA Package cross section
FBGA Road map
Fujitsu Microelectronics will provide the most suitable SiP to the customer's requirements with our extensive implementation
technologies.
Please do not hesitate to contact us.
FBGA Package line-up
Pin pitch : 0.50mm
| Pin count | Package size (mm) | Pin arrangement | Package code | |
|---|---|---|---|---|
| X | Y | |||
| 82 (IO73+TB9) | 6.0 | 6.0 | 2 rows | BGA-82P-M01 |
| 96 (IO96) | 6.0 | 6.0 | 3 rows | BGA-96P-M04 |
| 100 (IO100) | 7.0 | 7.0 | 2 + (1) + 1 rows | BGA-100P-M03 |
| 112 (IO112) | 7.0 | 7.0 | 3 rows (With nonexistent pins) |
BGA-112P-M05 |
| 232 (IO232) | 12.0 | 12.0 | 2 + (1) + 2 rows | BGA-232P-M01 |
| 240 (IO240+TB49) | 10.0 | 10.0 | 4 rows | BGA-240P-M02 |
| 240 (IO240+TB0) | 10.0 | 10.0 | 4 rows | BGA-240P-M03 |
| 289 (IO264+TB25) | 10.0 | 10.0 | 3 + (1) + 2 rows | BGA-289P-M01 |
| 304 (IO304) | 13.0 | 13.0 | 2 + (1) + 2 rows | BGA-304P-M05 |
| 304 (IO304) | 12.0 | 12.0 | 4 rows | BGA-304P-M07 |
| 337 (IO337+TB81) | 13.0 | 13.0 | 4 rows | BGA-337P-M02 |
| 385 (IO385+TB49) | 13.0 | 13.0 | 3 + (1) + 2 rows | BGA-385P-M01 |
| 385 (IO304+TB81) | 13.0 | 13.0 | 2 + (2) + 2 rows | BGA-385P-M02 |
| 385 (IO304+TB81) | 12.0 | 12.0 | 4 rows | BGA-385P-M03 |
| 400 (IO400+TB81) | 15.0 | 15.0 | 4 rows | BGA-400P-M04 |
| 586 (IO537+TB49) | 15.0 | 15.0 | 4 + (1) + 2 rows | BGA-586P-M04 |
| 610 (IO489+TB121) | 16.0 | 16.0 | 3 + (2) + 2 rows | BGA-610P-M01 |
| 650 (IO481+TB169) | 15.0 | 15.0 | 5 rows | BGA-650P-M03 |
| 753 (IO584+TB169) | 18.0 | 18.0 | 3 + (1) + 2 rows | BGA-753P-M01 |
*TB : Thermal Ball
Pin pitch : 0.65mm
| Pin count | Package size (mm) | Pin arrangement | Package code | |
|---|---|---|---|---|
| X | Y | |||
| 176 (IO176) | 11.0 | 11.0 | 4 rows | BGA-176P-M05 |
| 204 (IO204) | 11.0 | 11.0 | 3 + (1) + 2 rows | BGA-204P-M01 |
| 360 (IO360+TB81) | 16.0 | 16.0 | 5 rows | BGA-360P-M05 |
| 385 (IO360+TB25) | 16.0 | 16.0 | 5 rows | BGA-385P-M04 |
*TB : Thermal Ball
Pin pitch : 0.80mm
| Pin count | Package size (mm) | Pin arrangement | Package code | |
|---|---|---|---|---|
| X | Y | |||
| 112 (IO112) | 10.0 | 10.0 | 4 rows | BGA-112P-M04 |
| 144 (IO144) | 12.0 | 12.0 | 4 rows | BGA-144P-M06 |
| 144 (IO144) | 12.0 | 12.0 | 4 rows (With nonexistent pins) |
BGA-144P-M07 |
| 176 (IO176) | 12.0 | 12.0 | 5 rows (With nonexistent pins) |
BGA-176P-M04 |
| 192 (IO192) | 12.0 | 12.0 | Full Matrix (With nonexistent pins) |
BGA-192P-M06 |
| 224 (IO224) | 16.0 | 16.0 | 4 rows | BGA-224P-M06 |
| 224 (IO224+TB36) | 16.0 | 16.0 | 4 rows | BGA-224P-M08 |
| 224 (IO224+TB64) | 16.0 | 16.0 | 4 rows | BGA-224P-M09 |
| 240 (IO240) | 15.0 | 15.0 | 5 rows | BGA-240P-M06 |
| 256 (IO207+TB49) | 18.0 | 18.0 | 2 + (1) + 2 rows | BGA-256P-M17 |
| 272 (IO272+TB49) | 18.0 | 18.0 | 4 rows | BGA-272P-M06 |
| 272 (IO272) | 18.0 | 18.0 | 4 rows | BGA-272P-M08 |
| 320 (IO320+TB49) | 18.0 | 18.0 | 5 rows | BGA-320P-M05 |
| 441 (IO441) | 18.0 | 18.0 | Full Matrix | BGA-441P-M01 |
*TB : Thermal Ball
Please contact us for information on other packages.
Packages
Features
- Sealed with plastic resin to achieve high cost performance.
- Superior support for multi-pin.
- Package sizes at 27mmSQ, 31mmSQ, and 35mmSQ are available.
PBGA Package external view
PBGA Package cross section
Multi-pin BGA Package road map
Fujitsu Microelectronics will provide the most suitable SiP to the customer's requirements with our extensive implementation
technologies.
Please do not hesitate to contact us.
PBGA Package line-up
| Pin count | Package size (mm) | Pin arrangement | Pin pitch (mm) | |
|---|---|---|---|---|
| X | Y | |||
| 256 (IO256) | 27.0 | 27.0 | 4 rows | 1.27 |
| 320 (IO256+TB64) | 27.0 | 27.0 | 4 rows | 1.27 |
| 321 (IO321) | 19.0 | 19.0 | Full Matrix(With nonexistent pins) | 1.00 |
| 352 (IO352) | 35.0 | 35.0 | 4 rows | 1.27 |
| 353 (IO304+TB49) | 31.0 | 31.0 | 4 rows | 1.27 |
| 416 (IO352+TB64) | 27.0 | 27.0 | 4 rows | 1.00 |
| 416 (IO352+TB64) | 35.0 | 35.0 | 4 rows | 1.27 |
| 420 (IO420) | 35.0 | 35.0 | 5 rows | 1.27 |
| 480 (IO416+TB64) | 27.0 | 27.0 | 5 rows | 1.00 |
| 484 (IO420+TB64) | 27.0 | 27.0 | 5 rows | 1.00 |
| 484 (IO420+TB64) | 35.0 | 35.0 | 5 rows | 1.27 |
| 520 (IO420+TB100) | 35.0 | 35.0 | 5 rows | 1.27 |
| 543 (IO479+TB64) | 27.0 | 27.0 | 6 rows | 1.00 |
| 544 (IO480+TB64) | 27.0 | 27.0 | 6 rows | 1.00 |
| 564 (IO500+TB64) | 31.0 | 31.0 | 5 rows | 1.00 |
| 676 (IO676) | 27.0 | 27.0 | Full Matrix | 1.00 |
| 676 (IO576+TB100) | 35.0 | 35.0 | 5 rows | 1.00 |
| 772 (IO672+TB100) | 35.0 | 35.0 | 6 rows | 1.00 |
| 808 (IO708+TB100) | 35.0 | 35.0 | 5 + 2 rows | 1.00 |
| 868 (IO672+TB196) | 35.0 | 35.0 | 6 rows | 1.00 |
| 900 (IO756+TB144) | 35.0 | 35.0 | 7 rows | 1.00 |
| 1156 (IO1156) | 35.0 | 35.0 | Full Matrix | 1.00 |
*TB : Thermal Ball
Please contact us for information on other packages.
Packages
Features
- Superior thermal characteristics.
- Superior support for multi-pin.
- Package sizes at 27mmSQ and 35mmSQ are available.
TEBGA Package external view
TEBGA Package cross section
Multi-pin BGA Package road map
Fujitsu Microelectronics will provide the most suitable SiP to the customer's requirements with our extensive implementation
technologies.
Please do not hesitate to contact us.
TEBGA Package line-up
| Pin count | Package size (mm) | Pin arrangement | Pin pitch (mm) | |
|---|---|---|---|---|
| X | Y | |||
| 320 (IO256+TB64) | 27.0 | 27.0 | 4 rows | 1.27 |
| 416 (IO352+TB64) | 27.0 | 27.0 | 4 rows | 1.00 |
| 416 (IO352+TB64) | 35.0 | 35.0 | 4 rows | 1.27 |
| 480 (IO416+TB64) | 27.0 | 27.0 | 5 rows | 1.00 |
| 484 (IO420+TB64) | 27.0 | 27.0 | 5 rows | 1.00 |
| 484 (IO420+TB64) | 35.0 | 35.0 | 5 rows | 1.27 |
| 520 (IO420+TB100) | 35.0 | 35.0 | 5 rows | 1.27 |
| 543 (IO479+TB64) | 27.0 | 27.0 | 6 rows | 1.00 |
| 544 (IO480+TB64) | 27.0 | 27.0 | 6 rows | 1.00 |
| 676 (IO676) | 27.0 | 27.0 | Full Matrix | 1.00 |
| 676 (IO576+TB100) | 35.0 | 35.0 | 5 rows | 1.00 |
| 772 (IO672+TB100) | 35.0 | 35.0 | 6 rows | 1.00 |
| 808 (IO708+TB100) | 35.0 | 35.0 | 5 + 2 rows | 1.00 |
| 868 (IO672+TB196) | 35.0 | 35.0 | 6 rows | 1.00 |
| 900 (IO756+TB144) | 35.0 | 35.0 | 7 rows | 1.00 |
| 1156 (IO1156) | 35.0 | 35.0 | Full Matrix | 1.00 |
*TB : Thermal Ball
Please contact us for information on other packages.
Packages
Features
Superior electrical and thermal performance thanks to the flip chip bonding technology.
Wide support from consumer appliances to high-end.
- Support for ultra multi-pin by arranging the chip electrode over an area.
- Good dissipation of heat produced from the high electric consumption chip by deployment of a heat spreader.
- Capable of reduction of waveform distortion and high speed transmission (GHz level) for high frequencies.
- Fully customizable according to the customer's requirements.
FC-BGA Package external view
FC-PBGA Package cross section
FC-CBGA Package cross section
Multi-pin BGA Package road map
Fujitsu Microelectronics will provide the most suitable SiP to the customer's requirements with our extensive implementation
technologies.
Please do not hesitate to contact us.
FC-BGA Package line-up
FC-PBGA
| Pin count | Package size (mm) | Pin arrangement | Ball matrix | Pin pitch (mm) | |
|---|---|---|---|---|---|
| X | Y | ||||
| 400 | 21.0 | 21.0 | Full Matrix | 20 × 20 | 1.00 |
| 484 | 23.0 | 23.0 | Full Matrix | 22 × 22 | 1.00 |
| 625 | 17.0 | 17.0 | Full Matrix | 25 × 25 | 0.65 |
| 625 | 27.0 | 27.0 | Full Matrix | 25 × 25 | 1.00 |
| 729 | 29.0 | 29.0 | Full Matrix | 27 × 27 | 1.00 |
| 900 | 31.0 | 31.0 | Full Matrix | 30 × 30 | 1.00 |
| 1020 | 33.0 | 33.0 | Full Matrix | 32 × 32 | 1.00 |
| 1156 | 35.0 | 35.0 | Full Matrix | 34 × 34 | 1.00 |
| 1396 | 37.5 | 37.5 | Full Matrix | 37 × 37 | 1.00 |
| 1681 | 42.5 | 42.5 | Full Matrix | 41 × 41 | 1.00 |
FC-CBGA
| Pin count | Package size (mm) | Pin arrangement | Ball matrix | Pin pitch (mm) | |
|---|---|---|---|---|---|
| X | Y | ||||
| 625 | 27.0 | 27.0 | Full Matrix | 25 × 25 | 1.00 |
| 625 | 33.0 | 33.0 | Full Matrix | 25 × 25 | 1.27 |
| 728 | 35.0 | 35.0 | Full Matrix | 27 × 27 | 1.27 |
| 900 | 31.0 | 31.0 | Full Matrix | 30 × 30 | 1.00 |
| 900 | 40.0 | 40.0 | Full Matrix | 30 × 30 | 1.27 |
| 1089 | 42.5 | 42.5 | Full Matrix | 33 × 33 | 1.27 |
| 1156 | 35.0 | 35.0 | Full Matrix | 34 × 34 | 1.00 |
| 1225 | 45.0 | 45.0 | Full Matrix | 35 × 35 | 1.27 |
| 1369 | 37.5 | 37.5 | Full Matrix | 37 × 37 | 1.00 |
| 1681 | 42.5 | 42.5 | Full Matrix | 41 × 41 | 1.00 |
| 2116 | 47.5 | 47.5 | Full Matrix | 46 × 46 | 1.00 |
Please contact us for information on other packages.
Packages
Features
Ultra compact, ultra thin, multi-pin, and superior humidity and reflow resistance by wafer through-hole interconnections.
- Ultra compact, ultra thin, and light weight suitable for mobile devices and digital electric household appliances.
- Superior humidity and reflow resistance with JEDEC Level 1 standard.
- Support for pin pitch at less than 0.4mm contributing towards multi-pin.
- High speed transmission by reducing the wire length.
- Fully customizable according to the customer's requirements.
WL-CSP External view
WL-CSP Processes
WL-CSP Package cross section
WL-CSP Road map
| FY | 2008 | 2009 | 2010 | |
|---|---|---|---|---|
| WL-CSP Structure |
(BGA/LGA) |
 |
||
| Height(Min) | 0.30 mm | ← | 0.25 mm | |
| Ball/Land pitch(Min) | 0.30 mm | ← | 0.25 mm | |
| Ball/Land dia.(Min) | 0.15 mm | ← | 0.13 mm | |
| RDL Technology |
Line/Space | 15µm/20µm | 15µm/15µm | 10µm/15µm |
| Via/Land Pitch(Inline) | 50µm | ← | 40µm | |
| Others | Wafer size | 150/200/300mm (6/8/12inch) |
← | ← |
| Scribe Width (Min) 6/8 in 12 in |
90µm | ← | ← | |
| 90µm (<=0.35-t) | ← | ← | ||
| 100µm (>0.35-t) | ← | ← | ||
| Solder | Pb Free | ← | ← | |
| Mold resin | Halogen Free | ← | ← | |
WL-CSP Mass-production results
| WL-CSP | WLP195 | WLP309 | WLP42 | WLP70-01 | WLP70-02 | WLP108 |
|---|---|---|---|---|---|---|
| Wafer Size | 200 mm | 200 mm | 300 mm | 300 mm | 300 mm | 300 mm |
| Package Size | 5.97×5.97 mm | 7.56×7.56 mm | 3.30×2.95 mm | 3.408×4.486 mm | 3.408×4.486 mm | 5.06×4.46 mm |
| Package Height | 0.8mm Max | 0.8mm Max | 0.49mm Max | 0.49mm Max | 0.35mm Max | 0.6mm Max |
| Chip Thickness | 500µm TYP | 520µm TYP | 300µm TYP | 300µm TYP | 220µm TYP | 350µm TYP |
| Encapsulant Thickness |
70µm TYP | 50µm TYP | 50µm TYP | 50µm TYP | 50µm TYP | 50µm TYP |
| Ball Pitch | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm |
| Ball Height | 130µm TYP | 130µm TYP | 100µm TYP | 100µm TYP | 100µm TYP | 150µm TYP |
