Packages
Fujitsu produces a comprehensive lineup of packages, enabling it to offer the ideal package for a specific application in line with customer needs. We undertake fine pitch bump formation for both 200mm and 300mm wafers, and the design and assembly of flip chip packages ideal for high-speed I/O. In addition to QFP, FBGA, BGA and other standard packages, our diversified lineup includes ultra-low thermal resistance packages for high power applications, SiPs (system in a package) that combine multiple chips in one package, and BCCs for RF applications. Low-k materials are being increasingly used as wafer process technology evolves towards ever smaller feature size, from 90nm through 65nm to 45nm nodes and beyond. Fujitsu was among the first to apply low-k materials to the supply of high reliability packages to the market. We have also led other companies in addressing environmental issues through developing lead- and halogen-free packages, and introducing biodegradable packing trays and so forth. We not only assemble our own wafers, but also undertake the assembly of foundry wafers of other companies, providing such services both in Japan and overseas.
