Packages

Electronic products have been in growing demand, such as personal computers, mobile phones and PDAs, and its technology innovation has constantly come along. The IC technology is supporting customers to meet market demands today and in the future.

Packaging solutions enable to reduce size and space requirements as a key technology. The packages such as CSP (Chip Size Package or Chip Scale Package) and BGA (Ball Grid Array) have supported high-density wiring technology and widely used in the market.

Miniaturization forced the use of new approaches in die packaging in order to achieve the smallest possible solutions. Fujitsu Microelectronics has launched the mass-production of SON packages which was impressed as the world's smallest level.

Fujitsu Microelectronics has a mass-production lineup of super compact packages such as FBGA (Fine Pitch BGA) and WL-CSP (Wafer Level CSP) and beyond. The high pin count packages, PBGA (Plastic BGA) and TEBGA (Thermal Enhanced BGA) have been mass-produced in order to fulfill the size and weight limitations, for example portable equipment.

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