Fujitsu Semiconductor offers a wide range of technologies from 0.18µm to 40nm and beyond to meet customer needs.

Design Environment
Low-power Designs
Products
Standard Cell
Embedded Array
Gate Array

Fujitsu Semiconductor enlarges your business with our high quality wafers.

CMOS Logic Technologies

Wafer Prototyping

Test

Fab Information System "FF-eSERVE"

Fujitsu Semiconductor produces a comprehensive lineup of packages. In addition to surface-mounted packages QFP and HQFP, Fujitsu Semiconductor provides packages that include BGA and FCBGA to meet the application requirements of high pin-count.

Fujitsu Semiconductor provides IP macros accelerating the development of the most advanced SoC for customers.
In order to meet business' application-intensive needs, Fujitsu Semiconductor continues to develop a wide range of IP products for CPUs, media processing, image processing, and communication processing, and endeavors to use third party IP products.

Fujitsu Semiconductor helps the customers reduce PCB costs and PCB design risk for high-speed memory subsystem.
Fujitsu Semiconductor offers SiP (System in Package) solution consisting of ASIC and memory in single package, and has a great deal of experience in SiP solution.

• Memory Solution
• SiP Solution