Archived News January - June 2004 : FUJITSU

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Archived News January - June 2004

23 June 2004 Japan: Net-2Com and Fujitsu Develop World's First Wireless IP Handset Enabling Seamless Switching Between Wireless Networks
Tokyo , June 23, 2004 – Net-2Com Corporation and Fujitsu Laboratories Ltd. today jointly announced the development of the world's first wireless IP mobile handset capable of seamless switching between wireless LAN and public wireless networks. The prototype handset features built-in wireless LAN functions and enables free selection of public wireless networks through inserting various CompactFlash® (CF) networking cards, allowing global use. By adopting standard operating systems (OS) for PDAs, this handset supports a wide range of applications including business applications.
7 June 2004 USA: Fujitsu Introduces New 20A Slim Relay for HVAC and Major Appliances
Sunnyvale, CA, June 7, 2004 – Fujitsu Components America, Inc., today released a slim, 20A power relay that is targeted primarily to OEMs developing commercial and industrial products.
7 June 2004 USA: Fujitsu to Display New DACs, PLLs and PMICs at Annual IEEE MTT-S International Microwave Symposium
Sunnyvale, CA, June 7, 2004 – Fujitsu Microelectronics America, Inc (FMA),a leading supplier of analog and mixed signal ICs, will demonstrate its latest Digital-Analog Converters (DACs), Phase Locked Loop (PLL) devices, and Power Management ICs (PMICs) at the annual IEEE MTTS June 8-10 at the Fort Worth Convention Center. FMA also will display its Spread Spectrum Clock Generators (SSCGs) and Radio Frequency ICs (RFICs).
25 May 2004 USA: Fujitsu Announces Production Schedule for Industry's First Conductive Polymer Film Touch Panels
Sunnyvale, CA , May 25, 2004 – Fujitsu Components America, Inc., today announced it will begin North American marketing efforts for new resistive touch panels that use an extremely durable conductive polymer film and cost less to produce than conventional resistive touch panels. An industry-first technology developed by Fujitsu Laboratories Ltd. and Fujitsu Component Limited, the custom touch panels will start sampling in early 2005 with production following in Q2 2005.
11 May 2004 USA: Fujitsu Releases X2 Copper Transceiver Module for 10Gbit-CX4 Ethernet Applications
Sunnyvale, CA, May 11, 2004 – Fujitsu Components America, Inc. today announced the release of a copper electrical transceiver module compliant with the X2 multi-source agreement (MSA) specification Rev. 1.0b. The X2 x-mGC module transmits 10Gb/s Ethernet over 20m of standard InfiniBand copper cable (AWG24) or VSR parallel optics through a single port, offering a cost-effective, standards-compliant product targeted for multiple applications in 10Gb/s enterprise, storage, and telecom markets. Using the imbedded media detect circuit, transmission up to 300 meters over standard multi-mode can also be achieved using Fujitsu's o-MGC optical media converter.
10 May 2004 USA: Fujitsu Delivers Trio of ASICs to Innovative Start-up Greenfield Networks
Sunnyvale, CA, May 10, 2004 – Fujitsu Microelectronics America, Inc. (FMA) has delivered three high-performance ASICs to Greenfield Networks, Inc., the emerging leader in world-class Ethernet switch silicon technology. Greenfield Networks Packetry™ family of Ethernet switching products provides advanced packet processing and traffic management silicon solutions for a broad range of networking applications in enterprise and metro markets.
10 May 2004 USA: Fujitsu to Introduce Industry's First 10Gbps Ethernet Products at Annual Networld+Interop
Las Vegas, NV, May 10, 2004 – Fujitsu Microelectronics America, Inc. (FMA), Fujitsu Components America, Inc. (FCAI) and Eudyna Devices USA Inc. (EUDU), the new Fujitsu-Sumitomo joint venture (formerly Fujitsu Compound Semiconductor, Inc.) will bring the latest 10Gbps networking products and technology to Networld+Interop in Las Vegas May 11-13.
3 May 2004 USA: Fujitsu Brings to Market Copper XENPAK Module for Network/Server Markets
Sunnyvale, CA, May 3, 2004 – Fujitsu Components America, Inc., today released a copper XENPAK module (xMGC) that conforms to the new 10GBASE-CX4 specification (IEEE 802.03ak/D4.2) for low-cost 10-Gigabit copper Ethernet. The new module reduces the cost per port by offering a low-cost copper solution that has the flexibility to support VSR parallel optics through a single port.
30 April 2004 USA and Canada: Wi-LAN and Fujitsu Expect to Produce First-to-Market WiMAX Certified System
Sunnyvale, CA and Calgary, April 30, 2004 – Fujitsu Microelectronics America, Inc. (FMA), a leading global ASIC and semiconductor-solutions provider, and Wi-LAN Inc. (TSX:WIN), a global provider of broadband wireless communications products and technologies, today announced their joint goal to produce the world's first WiMAX Certified* broadband wireless system. System-on-Chip (SoC) engineering samples are planned for the fall of 2004, and the complete system is expected to be available for WiMAX Forum* conformance and interoperability testing in the first half of 2005.
26 April 2004 USA: Fujitsu to Feature Biometric Sensor ICs and Solutions, at Annual CTST in Washington, D.C., April 26-29
Washington, DC, April 26, 2004 – Fujitsu Microelectronics America, Inc. (FMA) will demonstrate its complete family of leading-edge biometric sensor ICs, including fully assembled modules and boards, at the annual CTST Conference April 26-29 in Washington, D.C.
20 April 2004 USA: Fujitsu Expands Its 7-Wire Touch Panel Offering
Sunnyvale, CA, April 20, 2004 – Fujitsu Components America, Inc. today announced it has expanded its 7-wire resistive touch panel offering with the addition of a 17-inch (diagonal) standard product. The company now offers OEMs and VARs a line of standard 7-wire touch panels ranging in size from 8.4 inches to 17 inches.
5 April 2004 USA: Fujitsu Expands Copper Connector Offering for High-Speed Switching Applications
Sunnyvale, CA, April 5, 2004 – Fujitsu Components America, Inc. today announced it has expanded its high-speed copper microGiGaCN™ connector series by adding a vertical board-mount I/O socket. The new socket expands Fujitsu's offering of standard, copper I/O and mid-plane interconnects that comply with InifiBand®, 10G CX4 Ethernet, and 10G Fiber Channel requirements while meeting the needs of other high-speed applications. For distances less than 20m, the microGiGaCN series provides a low-cost alternative to optical fiber.
1 April 2004 USA: Fujitsu Quantum Devices & Sumitomo Electric Industries Consolidate Compound Semiconductors Businesses
San Jose, CA, April 1, 2004 – Fujitsu Compound Semiconductor, Inc. announces that its parent company, Fujitsu Quantum Devices Limited (FQD) and the Electron Device Department of Sumitomo Electric Industries, Limited (SEI-EDD) today consolidated their compound semiconductor device businesses into a joint venture company, Eudyna Devices Inc. Eudyna Devices Inc. will be engaged in everything from development and manufacturing to sales of a wide variety of compound semiconductor devices and will aim to quickly establish the trust of customers as the world’s leader in the field.
24 March 2004 USA: Fujitsu Introduces New 10Gbps Ethernet Switch Chip Featuring 10GBASE-CX4 Interface Support
Sunnyvale, CA, March 24, 2004 – Fujitsu Microelectronics America, Inc. (FMA) and Fujitsu Laboratories of America, Inc. (FLA) today introduced their second-generation single-chip 10Gbps Ethernet switch, the MB87Q3070, built with the newly developed CX-4 high-speed electrical interface. The switch chip's CX-4 macro allows designers to use copper cabling instead of expensive optical interfaces in the interconnects between the switch chassis, and enables data transfer at distances over one meter in the backplane.
23 March 2004 Japan: Fujitsu Develops World's First CMOS Selector Chip Operating at 50 Gbps
Tokyo, March 23, 2004 – Fujitsu Laboratories Ltd. and Fujitsu Limited today announced the development of a selector chip using Fujitsu's CMOS technology capable of record-breaking 50-Gbps throughput. The new technology delivers the benefits of a highly integrated, low-power design in CMOS with the 40-Gbps performance levels required for devices used in high-bandwidth data communications, speeds that previously could only be attained using silicon-germanium chips or other compound semiconductors.
23 March 2004 Japan: Fujitsu to Manufacture Leading-Edge FPGA Products for Lattice Semiconductor
Tokyo, March 23, 2004 – In a press conference today, Fujitsu Limited (TSE: 6702), a leading provider of customer-focused IT and communications solutions for the global marketplace, and Lattice Semiconductor Corporation (NASDAQ: LSCC), a leading provider of programmable logic devices, announced an agreement under which Fujitsu Limited will manufacture Lattice Semiconductor's next-generation FPGA (field programmable gate array) products on its leading-edge 130-nanometer (nm) and 90nm CMOS process technologies, as well as a 130nm technology with embedded flash memory being jointly developed by Fujitsu and Lattice.
22 March 2004 USA: Fujitsu Accelerates the Performance of the World's Fastest CMOS 14-bit DAC
Sunnyvale, CA, March 22, 2004 – Fujitsu Microelectronics America, Inc. (FMA) and Fujitsu Microelectronics Europe (FME) today announced that the MB86064 dual 14-bit Digital-to-Analog converter (DAC) now features an industry-leading conversion rate of 1GSa/s. The rate has increased from 800MSa/s, and the revised specification retains the MB86064's position as the world's fastest CMOS DAC. (See FMA's related press release dated January 31, 2003.)
19 March 2004 Japan: Fujitsu to Construct New Facility for Mass Production of Logic Chips using 90nm and 65nm Process Technology
Tokyo, March 19, 2004 – Fujitsu Limited today announced that it has decided to construct a new facility at its Mie semiconductor plant in central Japan to mass-produce logic chips utilizing state-of-the-art 90-nanometer (nm) volume process technology as well as next-generation 65nm technology, and employing large-diameter 300mm wafers.
17 March 2004 Japan: IPFlex and Fujitsu Introduce DAP/DNA®-2, the Dynamically Reconfigurable Processor
Tokyo, March 17, 2004 – IPFlex Inc. and Fujitsu Limited today announced the commercial release of their jointly developed processor, the DAP/DNA®-2 (Digital Application Processor/Distributed Network Architecture), which features a unique ability to dynamically reconfigure its internal circuitry. Employing the newly developed processor enables systems to perform multiple processing tasks with a single-chip solution that previously required several specialized chips.
9 March 2004 Japan: Fujitsu Develops World's First Multi-layer PCB Capable of 5Gbps Transmission and 4000 Pin Mounting
Tokyo, March 9, 2004 – Fujitsu Laboratories Ltd., Fujitsu Interconnect Technologies Ltd., and Fujitsu Limited today announced the joint development of new manufacturing technologies for large-sized, high-count multi-layer printed circuit boards (PCBs) that enable support of 5Gigabits per second (5Gbps) high-speed transmission and 4000 pin high-density mounting (0.8mm pitch). Fujitsu's new technologies succeed in improving manufacturing yields and significantly reducing production time for high-count multi-layer PCBs. The technologies were developed for use in such areas as next-generation, high-speed servers and telecommunication base station equipment, which demand fast transmission speeds and high-density mounting.
9 March 2004 USA: Fujitsu’s 10 Gigabit Ethernet Layer-2 Single Chip Switch Will Highlight Server Blade Summit
Sunnyvale, CA, March 9, 2004 – Fujitsu Microelectronics America, Inc. (FMA) will feature the industry's first 12-port, single-chip 10 Gigabit Ethernet Layer-2 switch at the annual Server Blade Summit, March 9-11, at the Wyndham Hotel in San Jose.
8 March 2004 USA: Fujitsu Microelectronics' New Spread Spectrum Clock Generator Reduces EMI at High Frequencies
Sunnyvale, CA, March 8, 2004 – A new series of spread spectrum clock generators (SSCGs) from Fujitsu Microelectronics America, Inc. (FMA) reduces Electro Magnetic Interference (EMI) that results from higher frequency operation and increased IC integration.
8 March 2004 USA: Fujitsu Microelectronics Demonstrates New PLLs, Power Management and Spread Spectrum Clock Generators
Sunnyvale, CA, March 8, 2004 – Fujitsu Microelectronics America, Inc. (FMA) will introduce its newest Phased Lock Loop (PLL) frequency synthesizers and DC/DC converters, along with a new series of Spread Spectrum Clock Generators (SSCGs) at the annual Wireless System Design Conference at the San Diego Convention Center March 8-10.
8 March 2004 USA: Fujitsu Microelectronics Introduces New Spread Spectrum Clock Generator (SSCG) Devices
Sunnyvale, CA, March 8, 2004 – A new series of spread spectrum clock generators (SSCGs) from Fujitsu Microelectronics America, Inc. (FMA) reduces Electro Magnetic Interference (EMI) that results from higher frequency operation and increased IC integration.
8 March 2004 USA: New Power-Management Devices for Fast Switching, Miniaturization Requirements by Fujitsu Microelectronics
Sunnyvale, CA, March 8, 2004 – Fujitsu Microelectronics America, Inc. (FMA) today announced a new set of compact DC/DC converter ICs that provide independent control, soft-starting and fast-switching for communications equipment and consumer products.
8 March 2004 USA: Single-Serial-Input PLL Synthesizers Featuring Low Phase Noise, Supply Current for Mobile Communications
Sunnyvale, CA, March 8, 2004 – Fujitsu Microelectronics America, Inc. (FMA), a leading supplier of advanced devices for wireless communications applications, today introduced three single-serial-input Phase Locked Loop (PLL) frequency synthesizers featuring very low phase noise.
23 February 2004 USA: Announcement at Optical Fiber Communication Conference 2004
San Jose, CA, February 23, 2004 – Fujitsu Quantum Devices, Ltd.,.Mitsubishi Electric Corp., Oki Electric Industry Co., Ltd., Opnext, Inc. and Sumitomo Electric Industries, Ltd., today announced at the Optical Fiber Communication Conference 2004 (OFC 2004) the formation of a Multi-Source Agreement (MSA) to establish compatible sources of 10Gbit/s Transmitter Optical Sub-Assembly (TOSA) and Receiver Optical Sub-Assembly (ROSA) for use in the 10 Gbit/s XFP MSA defined module. This initiative standardizes the common mechanical dimensions, footprint and pin functions of the TOSA/ROSA devices; key compact optical components used in XFP modules.
23 February 2004 USA: Fujitsu Announces a New APD Receiver Optical Sub Assembly
San Jose, CA, February 23, 2004 – Fujitsu Compound Semiconductor, Inc. (FCSI) of San Jose, CA announces a new APD Receiver Optical Sub Assembly (ROSA) for 10G Base-ER Ethernet and 10Gb/s SONET / SDH LR2 applications. The APD ROSA is designed for Xenpack, X2 transponder, and XFP transceiver applications. An APD and a TIA are integrated in a small 8 pin package - FRM5N141QW (LC) and FRM5N141QY (SC). Including the receptacle, the package size is W5.7 x H5.7 x L17 mm. The receptacle has a fiber stub to guarantee an optical return loss of 27 dB. A thermistor is also integrated into the package for APD temperature monitoring. The APD ROSA has a high sensitivity of -27 dBm typical and low TIA power consumption of 0.3 W or less.
23 February 2004 USA: Fujitsu Announces a New Modulator Integrated DFB
San Jose, CA, February 23, 2004 – Fujitsu Compound Semiconductor, Inc. announces a new Modulator Integrated DFB (MI-DFB*) Laser with an integrated Fabry-Perot etalon for wavelength locking. The FLD5F20CE-Exxxx is for 9.95328 Gb/s Dense Wavelength Division Multiplexing (DWDM) applications. The transmission capacity is up to 1600 ps/nm corresponding to 80km. The FLD5F20CE-Exxxx can be tuned to an ITU-T 50GHz spaced channel in the C-band via adjustment of chip temperature with the included TEC. The included wavelength locker allows the output wavelength to be locked to an ITU-T grid channel and to remove any wavelength drift that may arise from the MI-DFB laser over its lifetime or case temperature variations. This device comes in a compact 7 pin package with a GPO connector for modulation voltage. This laser is available at any of the 85 ITU-T channels in the C-band (191.8-196.0 THz).
20 February 2004 USA: Fujitsu Announces a New Driver IC Integrated Modulator
San Jose, CA, February 20, 2004 – Fujitsu Compound Semiconductor, Inc. announces a new Driver IC Integrated Modulator Integrated (MI) DFB Laser Diode Module for 80km SONET/SDH applications. The FTM1141GF-C was developed to reduce the size and technical complexity of 10Gb/s Optical Transmitter board designs and includes a driver and MI-DFB laser in one package. This eliminates customer concerns regarding how to handle the RF interfacing between these two components on the board. The FTM1141GF-C has been designed with a differential co-planar electrical interface, which allows for easy interfacing to RF lines on PC boards. The package and pin layout are part of a multi-source agreement. This 1.5um single mode light source operates between 0-75 degC and has optical output power greater than 1dBm.
20 February 2004 USA: Fujitsu Announces New APD/TIA and PIN/TIA Receiver Modules
San Jose, CA, February 20, 2004 – Fujitsu Compound Semiconductor, Inc. (FCSI) of San Jose, CA announces new APD / TIA and PIN / TIA receiver modules with integrated Variable Optical Attenuators (VOA) for 10Gb/s Wavelength Division Multiplexing (WDM) applications. The FRM5N144DS and FRM5J144DS have APD or PIN-PD, TIA and MEMS VOA in an industry standard 16 pin butterfly package. The attenuation range of the VOA is 20 dB or more. The overload characteristics have been improved by integrating VOA because VOA controls optical input power level. As a result of this, the receivers have much wider dynamic range (-24 dBm to +6 dBm for APD / TIA and -18 dBm to +10 dBm for PIN / TIA) than current receivers. And these devices are suitable for 10Gb/s WDM applications for linear operation.
19 February 2004 UK: Fujitsu, OASIS and mycable Present a Multimedia Solution for Car Entertainment Based on MOST® Standard
London, February 19, 2004 – Fujitsu Microelectronics Europe and OASIS SiliconSystems AG, a leader in Media Oriented Systems Transport (MOST) technology, have formed a collaboration to develop reference designs for Multimedia Car Systems including Fujitsu's MPEG Encoder. The new products are called VideoCompressor 4 MOST and DVDPlayer 4 MOST.
19 February 2004 UK: Fujitsu Introduces New Bluetooth® Wireless Technology Module for Embedded Applications
London, February 19, 2004 – Fujitsu Microelectronics Europe announces a new Bluetooth® surface-mount type wireless technology module (version 1.1 compliant), ideally suited to embedded applications.
19 February 2004 UK: Fujitsu Microelectronics Announces Production Start of 16LX Microcontroller
London, February 19, 2004 – Fujitsu announces a new 16LX microcontroller to complement its portfolio of microcontrollers with Controller Area Network (CAN) interface. This latest product has been designed for automotive body control and comfort applications. In automatic air-conditioning, light control, seat control and sensor systems the product supports driver or passenger comfort and safety features.
19 February 2004 UK: Fujitsu Microelectronics Introduces a Next Generation General Purpose 32-bit RISC Microcontroller
London, February 19, 2004 – Fujitsu Microelectronics announces a new 32-bit RISC microcontroller implemented in 0.25µm CMOS technology and operating at 3.3V. With its flexible configuration, supporting 16-bit/32-bit SDRAMs and numerous other memory interfaces, this new controller is ideal for applications requiring simultaneous implementation of fast data processing and control of peripheral resources.
18 February 2004 USA: Fujitsu Microelectronics to Highlight 10-Gigabit Ethernet Technology at OFC 2004
Sunnyvale, CA, February 18, 2004 – Fujitsu Microelectronics America, Inc. (FMA), a leader in advanced network application-specific semiconductor products for 10Gbps systems, will present the industry's first single-chip 10Gbps Ethernet switch IC at booth 4113 during the annual Optical Fiber Communications Conference (OFC), February 24-26 at the Los Angeles Convention Center.
17 February 2004 Japan: Fujitsu Develops Ultra-Low-Power Transceiver Chipset for Next-Generation Optical Transmissions Systems
Kawasaki, February 17, 2004 – Fujitsu Laboratories Ltd. today announced the development of a new communications chipset that uses Indium Phosphide-based high-electron mobility transistor (InP-HEMT) technology to enable 50-Gbps operation of a 4:1 multiplexer and 1:4 demultiplexer chipset. Fujitsu's newly developed chipset is the world's first to achieve superior signal quality and operating margins in full-rate clocking scheme, with breakthrough low-power consumption of less than 1 watt (70% lower than conventional technology).
29 January 2004 Japan: Fujitsu Reports FY 2003 Third-Quarter Financial Results
Tokyo, January 29, 2004 – Fujitsu Limited, a leader in customer-focused IT and communications solutions for the global marketplace, today reported consolidated net sales of 1,068.2 billion yen (approximately US$9.9 billion*) for the third quarter of fiscal year 2003 (October 1 - December 31, 2003), a 5.0% increase over the third quarter of fiscal 2002. The company posted higher year-over-year third-quarter sales in each of its main business segments - Software & Services, Platforms, and Electronic Devices. In addition to strong sales of semiconductors and other electronic devices, sales of new server and storage system models contributed to the positive results. Higher sales and the effects of cost cutting initiatives combined to produce an operating profit of 10.1 billion yen (US$94.4 million) for the third quarter, with all three business segments posting an operating profit for the quarter.
29 January 2004 Japan: FDK Announcement of FY2003 3rd Quarter Net Sales
Tokyo, January 29, 2004 – Announcement of FY2003 3rd Quarter Net Sales
26 January 2004 Japan / USA: Fujitsu and MoSys Tie Technology License for 1T-SRAM-Q Embedded Memory
Tokyo, Japan / Sunnyvale, CA, USA, January 26, 2004 – MoSys, Inc. (NASDAQ: MOSY) the industry's leading provider of high density system-on-chip (SoC) embedded memory solutions, and Fujitsu Limited (TSE: 6702), a leading provider of customer-focused IT and communications solutions for the global marketplace, today announced an agreement under which MoSys' innovative quad density 1T-SRAM-QTM technology is licensed to Fujitsu Limited for use on its 0.13-micron logic process. Fujitsu will use MoSys' 1T-SRAM-Q to provide high-density embedded memory solutions for their SoC designs in consumer applications, including digital cameras and video camcorders. Fujitsu ranks as the largest Japanese ASIC vendor, attributable to its successes in these markets.

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