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Archived News July - December 2003
- 25 December 2003 Japan
- Fujitsu and Sumitomo Electric Establish Joint Venture in Compound Semiconductor Devices
Tokyo, December 25, 2003 – Fujitsu Limited and Sumitomo Electric Industries, Ltd. today announced that they have reached a basic agreement to create a joint venture that will consolidate the operations of Fujitsu Quantum Devices Limited, a wholly owned subsidiary of Fujitsu that is focused on the development, manufacture and sales of compound semiconductors, with the electronic devices business of Sumitomo Electric's compound semiconductor operations. Fujitsu and Sumitomo Electric will each have an equal equity ownership in the joint venture.
- 22 December 2003 Japan
- Fujitsu Develops World's First Touch Panel Using Conductive Polymer Film
Tokyo, December 22, 2003 – Fujitsu Laboratories Ltd. and Fujitsu Component Limited today announced the joint development of the world's first resistive touch panel that uses a conductive polymer film, a transparent conductive film that offers durability 10 times that of the conventional ITO film and succeeds in reducing production costs to less than half. Volume production capabilities for this breakthrough technology have been confirmed.
- 16 December 2003 USA
- Fujitsu Microelectronics America & Cogent Systems Provide Comprehensive Fingerprint Biometric Solutions
Sunnyvale, CA, December 16, 2003 – Fujitsu Microelectronics America, Inc. (FMA), a leader in biometric fingerprint sensor hardware, and Cogent Systems Inc., a leading developer of integrated biometric solutions, will collaborate on the development of new biometric security designs for government and commercial applications. The two companies will develop solutions for network security, physical and logical access control, positive ID for identity documents, and mobile/wireless security.
- 15 December 2003 Japan
- Fujitsu Achieves Breakthrough in Ultrafine-Pitch Solder Bumping and Flip-Chip Bonding
Tokyo, December 15, 2003 – Fujitsu Limited today announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps, and high-precision flip-chip bonding interconnection. This breakthrough technology increases connection density by approximately 50 times compared to conventional flip chip interconnections and actualizes downsizing of LSIs and LSI packaging.
- 8 December 2003 Japan
- Fujitsu Achieves Breakthrough Output with Gallium Nitride HEMT Amplifier
Kawasaki, December 8, 2003 – Fujitsu Laboratories Ltd. today announced that it has developed a gallium nitride (GaN) high electron mobility transistor (HEMT) amplifier (Figure 1) which achieves the world's highest power output of 174 watts at 63 volts, while demonstrating unprecedented record drain efficiency of 40%, fulfilling W-CDMA system requirements for base stations. This breakthrough represents a significant step forward in making smaller and more energy efficient base stations for 3G mobile networks, and overcomes the technical hurdle for output needs exceeding 150 watts required for realistic application in 3G mobile systems.
- 24 November 2003 USA
- Fujitsu Adds Ultra-Slim Solid State Relay for Industrial and Appliance Markets
Sunnyvale, CA, November 24, 2003 – Fujitsu Components America, Inc. today announced it has expanded its relay offering for the industrial control and appliance markets with the addition of an ultra-slim solid-state device.
- 20 November 2003 USA
- Fujitsu Introduces ARM9 Multi-CPU Evaluation Device
Sunnyvale, CA, November 20, 2003 – Fujitsu Microelectronics America, Inc. (FMA) today introduced a new ARM9 multi-CPU evaluation device, the MB87Q1100, as part of a platform developed to enable customers to design large, complex systems with very high levels of predictability and efficiency. The MB87Q1100 integrates the ARM926EJ-S and ARM946E-S embedded macrocell cores in Fujitsu's next-generation System-on-Chip (SoC) platform.
- 20 November 2003 USA
- Fujitsu Licenses Verification Technology to Cadence
Sunnyvale, CA, November 20, 2003 – Fujitsu Limited, a leading provider of customer-focused IT and communications solutions for the global marketplace, today announced it has licensed three verification technology patents to Cadence Design Systems, Inc. The agreement provides Cadence® with extended technologies related to equivalence checking for system-on-chip design verification.
- 18 November 2003 UK
- Fujitsu Introduces Fingerprint Module Stack - An "All in One" Embedded System Solution
London, November 18, 2003 – Fujitsu Microelectronics Europe (FME) today announced an all-in-one embedded fingerprint system solution MDFP200. This new module stack allows customers to shorten their development cycles and achieve faster time-to-market. Target applications are access control & management systems and various personal identification systems.
- 12 November 2003 Japan
- Fujitsu's Plasma Tube Technologies Herald Advent of 100-Inch-Plus Flat-Screen Displays
Kawasaki, November 12, 2003 – Fujitsu Laboratories Ltd. today announced the development of a revolutionary new plasma tube technology to produce narrow glass tubes, measuring one meter in length and one-millimeter in diameter, that emit light using the same phosphor structure as in a conventional PDP (plasma display panel). In addition, the company has developed a technology that sandwiches an array of these plasma tubes between two electrode plates to make up a display panel. Fujitsu succeeded in producing a prototype panel using 128 plasma tubes (for a screen size of 128 mm x 1 m) that display moving images in color.
- 7 November 2003 Germany
- Fujitsu Announces ARM9 Multi-CPU Evaluation Device Implementing Next-Generation SoC Platform
Frankfurt, November 7, 2003 – Fujitsu has announced the development of an ARM9 multi-CPU evaluation device, the MB87Q1100, which implements the next - generation SoC (System-on-Chip) platform, integrating ARM926EJ-S and ARM946E-S embedded macrocell cores.
- 31 October 2003 Japan
- Fujitsu Establishes New Semiconductor Subsidiary in Shanghai
Tokyo, October 31, 2003 – Fujitsu Limited today announced the establishment of a new subsidiary in Shanghai, Fujitsu Microelectronics (Shanghai) Co., Ltd., as part of the company's ongoing strategy to strengthen its profile in China's semiconductor market. The new subsidiary, which will serve as a center for the design, development, and sales of semiconductors in the region, began operations on October 30.
- 29 October 2003 Japan
- Announcement of the Revised Achievements Forecast
Tokyo, October 29, 2003 – FDK CORPORATION announced today, based on the latest achievements, the predicted achievement in the settlement-of-accounts, which was announced on April 25, 2003, are revised as follows:
- 28 October 2003 Japan
- Fujitsu Develops the FR80, Highest-Performance CPU Core for 32-bit RISC MCUs
Tokyo, October 28, 2003 – Fujitsu Limited today announced the development of the FR80, the most powerful processor core to date for its FR family of 32-bit RISC microcontrollers that are primarily used in digital home appliances.
- 21 October 2003 USA
- Fujitsu Interconnect Technologies Introduces Third-Generation Technology for Printed Circuit Boards
Sunnyvale, CA, October 21, 2003 – Fujitsu Interconnect Technologies Limited (FICT) today introduced products based on its next-generation Multi-Via 3 (MV3) technology, which reduces manufacturing costs and makes it easier to design multi-layer Printed Circuit Boards (PCBs).
- 16 October 2003 USA
- Fujitsu Microelectronics America to Demonstrate Innovative Single-chip 10Gbps Ethernet Switch IC
Sunnyvale, CA, October 16, 2003 – Fujitsu Microelectronics America Inc. (FMA) will demonstrate its innovative single-chip 10Gbps Ethernet switch at booth 624 during the annual Network Processors West Conference at Parkside Hall in San Jose October 21-23.
- 9 October 2003 Germany
- Fujitsu Microelectronics Europe Wins Component Product of the Year Award
Frankfurt, October 9, 2003 – Fujitsu Microelectronics Europe has won the Component Product of the Year award for its dual 14-bit 800MSa/s digital to analogue converter (MB86064), the world's fastest CMOS DAC
- 6 October 2003 Japan
- FDK Launches Non-Isolated Point-of-Load DC-DC Converters "W series"
Tokyo, October 6, 2003 – FDK CORPORATION launches non-isolated point-of-load DC-DC converters "W series", which comprise 72 models in November this year, With electric power efficiency up to 95% at the maximum as a high-efficiency POL (Point of Load) power supply that respond to decentralization of electric equipment.
- 6 October 2003 Germany
- Fujitsu Microelectronics Europe and Accemic Announce First Single-Chip Monitor Debugger
Frankfurt, October 6, 2003 – Fujitsu Microelectronics Europe (FME) and Accemic have announced the availability of the first single-chip monitor debugger for Fujitsu's FR 32-bit microcontroller Series.
- 30 September 2003 Japan / USA
- Fujitsu and Synopsys Launch SoC Design Consulting Service
Tokyo, Japan / Mountain View, CA, USA, September 30, 2003 – Fujitsu Limited, Japan's largest ASIC vendor, and Synopsys, Inc. (Nasdaq: SNPS), the world leader in semiconductor design software, today announced a new design consulting service to help system-on-chip (SoC) designers improve the quality of designs, and thereby reduce design cycles. The companies' joint SoC design consulting service brings together Synopsys' consulting expertise in logic and physical synthesis with Fujitsu's expertise in leading-edge physical design technologies. This combination provides integrated support for customers' design processes, from the SoC specification through logic and physical synthesis to the physical design implementation stage. The service is currently available in Japan and will gradually be expanded to other markets throughout the world.
- 25 September 2003 Germany
- Fujitsu Rolls Out First 10Gbps SERDES Macro for Networking Designs
Frankfurt, September 25, 2003 – Fujitsu Microelectronics Europe (FME) has recently introduced its new 10Gbps serial transceiver macro, the HS9GX, for ASIC-based networking and communications applications.
- 24 September 2003 USA
- Pulse-LINK Selects Fujitsu Microelectronics America to Co-develop CMOS SoC ASIC
San Diego and Sunnyvale, CA, September 24, 2003 – Pulse~LINK, Inc. and Fujitsu Microelectronics America, Inc. (FMA) today signed an agreement to jointly develop a digital baseband processor using Fujitsu’s 0.11-micron CMOS SoC ASIC solutions. This ASIC will be used in the Pulse~LINK system designed specifically for the world’s first Ultra Wideband Wireless Local Area Network (WLAN).
- 9 September 2003 USA
- Fujitsu Microelectronics America Delivers a Series of High-Performance ASICs to Foundry Networks
Sunnyvale, CA, September 9, 2003 – Fujitsu Microelectronics America, Inc. (FMA) has delivered three generations of ASICs to Foundry Networks, Inc. (Nasdaq:FDRY), the industry’s leading networking supplier, for several families of networking products. The ASICs are the result of the ongoing collaboration between the two organizations.
- 9 September 2003 USA
- New 32-Bit FR60Lite RISC Microcontrollers Deliver Low Power Operation, Fast A/D Converters
Sunnyvale, CA, September 9, 2003 – Fujitsu Microelectronics America, Inc. (FMA) today introduced a set of 32-bit controllers from its FR60Lite Series that deliver excellent performance for digital consumer products, and feature power requirements as low as one milliamp per MHz. This new series of 32-bit microcontrollers is built using Fujitsu’s latest wafer technology, and is designed to provide a cost-efficient upgrade path for users of 16-bit MCUs who want 32-bit performance.
- 9 September 2003 USA
- New FRAM ICs for Security, Microcontroller, Radio Frequency ID Applications
Sunnyvale, CA, September 9, 2003 – Fujitsu Microelectronics America, Inc. (FMA) today introduced to the North American markets two new ferroelectric RAM (FRAM) products developed for security, computing and Radio Frequency Identification (RFID) applications.
- 3 September 2003 USA
- Fujitsu Demonstrates New 10Gbps Ethernet Switch IC at Gigabit Ethernet Conference
Sunnyvale, CA, September 3, 2003 – Fujitsu Microelectronics America, Inc. (FMA) will present demonstrations of its industry’s first single-chip 10Gbps Ethernet switch IC at the annual Gigabit Ethernet Conference (GEC), September 8-10, at the Orange County Convention Center in Orlando, Florida. This year’s GEC is held as a part of National Fiber Optic Engineers Conference (NFOEC).
- 27 August 2003 Japan
- Fujitsu to Consolidate its Japan-Based Semiconductor Assembly and Testing Operations
Tokyo, August 27, 2003 – Fujitsu Limited today announced that it will consolidate its four semiconductor back-end assembly and testing subsidiaries in Japan into one newly-established company with four facilities. The new company, Fujitsu Integrated Microtechnology Limited, will focus on the back-end assembly and testing of logic chips, integrating the unique product lines and technological strengths of each of the four units into one highly competitive organization with improved efficiencies.
- 25 August 2003 Singapore
- Fujitsu Expands High-Speed Connector Series to Support Serial- Attached SCSI & ATA, and 10G Fiber Channel
Singapore, August 25, 2003 – Fujitsu Components Asia, Limited has expanded its microGiGaCNTM high-speed, differential connector line by adding an I/O plug with thumbscrews, which is the standard I/O configuration for Serial Attached SCSI 4-lane, Serial ATA-2 4-lane and 10G Fiber Channel technology. Fujitsu’s microGiGaCN series now offers a full-range of industry-standard, high-speed copper interconnects for various high-speed transport technologies.
- 25 August 2003 USA
- Fujitsu Microelectronics America Introduces New 128Mbit Burst Mode Mobile FCRAM
Sunnyvale, CA, August 25, 2003 – Fujitsu Microelectronics America, Inc. (FMA) has introduced a new 128Mbit mobile FCRAM device based on the company's Fast Cycle RAM (FCRAMTM) architecture.
- 21 August 2003 Japan
- Fujitsu Introduces 128Mbit Mobile FCRAM with Burst Mode Operation
Tokyo, August 21, 2003 – Fujitsu Limited today announced the availability of a new 128Mbit Mobile Fast Cycle RAMTM device for mobile phone applications. The new Mobile FCRAM, the MB82DBR08163, adopts burst mode operations compliant with the Common Specifications for Mobile RAM. The device's high-speed performance and large density make it ideal for 3G cellular phone vendors looking to provide advanced applications.
- 19 August 2003 USA
- ScanSnap!™ Streamlines Operations and Data Archiving among Small Businesses in the Accounting Industry
San Jose, CA, August 19, 2003 – Fujitsu Computer Products of America, Inc. (FCPA), a market leader in document imaging scanners and services, today announced that the new Fujitsu ScanSnap!™ scanner is making significant headway among small businesses within the paper-intensive accounting industry by enabling simplified and streamlined tax preparation and filing operations. Users have already realized monetary savings due to ScanSnap!'s one-step centralized approach to paper-to-digital conversion of hardcopy documents, resulting in increased employee productivity and maximizing use of expensive office space.
- 8 August 2003 Germany
- Fujitsu Introduces New PLLs with Industry's Smallest Package - Low Power for High Frequency Applications
Frankfurt, August 8, 2003 – Fujitsu Microelectronics Europe has announced the MB15F7xUV series, a new family of sub-miniature dual PLL frequency synthesisers designed for the high frequency mobile communications market.
- 5 August 2003 USA
- Fujitsu Microelectronics' Dual PLL Frequency Synthesizer Features Very Low Power and Current, for WAP
Sunnyvale, CA, August 5, 2003 – A new series of ultra-small Dual PLL frequency synthesizers, featuring power supply current as low as 2.5 milliamps (mA) at 2.7V, is available now from Fujitsu Microelectronics America, Inc. (FMA).
- 5 August 2003 USA
- Sybase and Fujitsu Software Corporation Forge New Strategic Partnership
Orlando, FL and San Jose, CA, August 5, 2003 – Sybase, Inc. (NYSE: SY), a leading enterprise infrastructure and integration company, and Fujitsu Software Corporation (Fujitsu), a leading provider of customer-focused IT and communications solutions for the global marketplace, today announced they signed a Memorandum of Understanding to form a new partnership. Fujitsu will market Sybase’s Content Capture technology and offer it as a component of Fujitsu Interstage Portalworks, and Sybase will integrate Fujitsu’s Interstage XWand Developer XBRL (eXtensible Business Reporting Language) solution with PowerDesigner, Sybase’s all-in-one modeling and design tool and co-market the combined solution.
- 29 July 2003 USA
- Fujitsu Releases Matched-Impedance Loop Back Module for High-Speed Systems
Sunnyvale, CA, July 29, 2003 – Fujitsu Components America, Inc. today released a matched-impedance loop-back module for testing systems operating at 500Mbps to 3.2Gbps per channel. The new module is an expansion of Fujitsu’s high-speed, microGiGaCNTM differential connector series.
- 28 July 2003 Germany
- Fujitsu Develops 90nm CMOS Technology for Digital Consumer and Mobile Applications
Frankfurt, July 28, 2003 – Fujitsu recently announced that is has developed and begun accepting orders for the CS101 Series of system-on-chips (SoCs) employing its state-of-the-art 90nm CMOS technology.
- 22 July 2003 USA
- Fujitsu Microelectronics' New MBF310 Fingerprint Sensor Ideal for New Generation of Mobile Phones
Sunnyvale, CA, July 22, 2003 – Fujitsu Microelectronics America, Inc. (FMA) today introduced its new MBF310 capacitive-based fingerprint Sweep SensorTM. With its advanced Auto-Finger Detection (AFD) circuit and on-board FIFO memory, the compact design optimizes power consumption and CPU efficiency, making it ideal for the next generation of mobile phones.
- 10 July 2003 Singapore
- Fujitsu and Motorola Make Fingerprint Recognition Technology Possible for Handhelds
Singapore, July 10, 2003 – Fujitsu Microelectronics Asia Pte Ltd, one of the leading suppliers of Biometric Fingerprint Sensors and Motorola Semiconductors Hong Kong Ltd, one of the world leaders in micro-processors, today announced a co-operation in the development of an Advanced PDA Reference Solution supporting Biometric Fingerprint Authentication.
- 3 July 2003 Japan
- Fujitsu Introduces New Built-In OSDC and USB Host 32-bit RISC Microcontroller
Tokyo, July 3, 2003 – Fujitsu Limited today announced that it has jointly developed with subsidiary Fujitsu VLSI Limited, a new 32-bit RISC microcontroller that controls character displays for television screens/monitors, including cathode ray tubes (CRTs), liquid crystal displays (LCDs), and plasma display panels (PDPs). The new MCU, the MB91F312, is embedded with both a high-resolution onscreen display controller (OSDC) and a universal serial bus (USB) host interface, enabling customers to deliver high-resolution, high-performance home theater systems.
- 1 July 2003 Japan
- FDK Launches Multi-layer Power Inductor for Compact Electronic Apparatus
Tokyo, July 1, 2003 – FDK CORPORATION has released 4 models of multi-layer power inductor "MIP series" for compact electronic apparatus, such as cellular phone, digital camera, and PDA, etc. The series has a significant effect in reducing direct-current resistance and has a thickness of 1.0mm.
