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  • December 1, 2014 Japan
    Fujitsu Semiconductor starts operations of new foundry companies
    Fujitsu semiconductor Limited (Head office: Yokohama, Kanagawa, Japan, President: Haruki Okada) today announced that following new companies started operations: “Mie Fujitsu Semiconductor Limited”, which mainly consists of the 300mm wafer manufacturing facilities in Mie, “Aizu Fujitsu Semiconductor Wafer Solution Limited”, from 150mm wafer fab in Aizu-Wakamatsu, “Aizu Fujitsu Semiconductor Manufacturing Limited”, from 200mm wafer fab also in Aizu-Wakamatsu, and “Aizu Fujitsu Semiconductor Limited”, which will be controlling the operations of both the 150mm and 200mm companies in Aizu-Wakamatsu.
  • December 1, 2014 Japan
    Fujitsu Semiconductor Announces Executive Appointment and Resignation
    Fujitsu Semiconductor Limited announced the following executive appointment and resignation, which took effect on December 1, 2014.
  • August 29, 2014 Japan
    UMC Joins Fujitsu's New Foundry Company
    United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC") and Fujitsu Semiconductor Limited ("Fujitsu Semiconductor") today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan ("the Company").