United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC") and Fujitsu Semiconductor Limited ("Fujitsu Semiconductor") today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan ("the Company").
Fujitsu Semiconductor Limited and ON Semiconductor (Nasdaq: ONNN) today announced that they have entered into a foundry services agreement. Under the terms of this agreement, Fujitsu will manufacture wafers for ON Semiconductor at its 8-inch front-end semiconductor wafer fabrication facility located in Aizu-Wakamatsu, Japan. Initial production of wafers is expected to begin within a year from today and ON Semiconductor will have the opportunity to access additional capacity in the Aizu-Wakamatsu fab in the future.
Fujitsu Limited and Fujitsu Semiconductor Limited have today entered into an official contract with Panasonic Corporation and Development Bank of Japan Inc. (DBJ) whereby Fujitsu Semiconductor and Panasonic would integrate their System LSI businesses, and together with investment from DBJ, a new independent fabless company will be established. These developments are a result of the deliberations Fujitsu Limited and Fujitsu Semiconductor have made based on the February 7, 2013 announcement, "Fujitsu Announces Restructuring and New Direction of its Semiconductor Business."