PCBs & IC Substrates
PCBs & IC Substrates
Fujitsu Interconnect Technologies provides various solutions expanding from circuit design to mass production of products, enabling customers to realize high reliability, high performance and value-added designs. Our business fields are High Performance Computing, Networking, Semiconductor, Automotive, Industrial, Medical, Mobile and other Omnipresent systems and devices.
We support customers to develop their devices by providing various services including board simulations, PWB design and assembly (PWB prototype development, reliability testing and failure analysis).
We provide our customers with a variety of board simulations which ensure an optimized product development cycle. These simulations such as electrical and physical simulations help to shorten the design, development, and lead times, thus reducing development costs.
We propose design rules to satisfy electrical performance, optimal materials and stack-up designs based on the requirements and the concept of our customers. We consider the final board design therefore we can offer a short development and design period, which results in a lower overall cost.
We offer short delivery times across all stages of product development from prototype assembly to high-volume production of printed circuit boards. We also offer reliability evaluation and failure analysis which are necessary in product development.
We offer high-reliable and high-performance PCBs and IC substrates in a variety of fields such as ICT infrastructure, semiconductor products and systems, vehicle systems, and mobile products to support your manufacturing.
F-ALCS is an innovative technology that enables high speed signal transmission with high density wiring capacity. This technology enables your product to stay competitive through higher performance.
Our state-of-the-art HDI PCB multi via technology ensures high reliability and high density of wiring capacity. This technology is suitable for automobile parts which require high reliability or parts for thinner and lighter products.
High performance substrate, GigaModule Series enables high speed and high density substrates tailored to customer needs and requirements.
Highly precise, ultrafine micromachining and drilling through holes in various meterials (i.e. metal, resin, glass and ceramic).
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