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Microelectronics

19 November 2009 USA: Symmetry Electronics and Fujitsu Microelectronics America Announce New Distribution Agreement for the Americas
Hawthorne and Sunnyvale, Calif., November 19, 2009 – Symmetry Electronics and Fujitsu Microelectronics America Announce New Distribution Agreement for the Americas
17 November 2009 Singapore: Fujitsu Announces Fast-Response DC/DC Converter IC for Consumer Electronics
Singapore, November 17, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced a new two-channel DC/DC converter IC with fast transient response, for use in digital consumer products, such as LCD TVs and digital video recorders. This new DC/DC converter IC, the MB39A145, utilizes a “bottom detection comparator method”, and includes new enhanced circuits which provide changes in voltage, for changes in current to realize a more stable and low ripple output voltage.
16 November 2009 Japan: Fujitsu Announces Fast-Response DC/DC Converter IC for Consumer Electronics
Tokyo, November 16, 2009 – Fujitsu Microelectronics Limited today announced a new two-channel DC/DC converter IC with fast transient response, for use in digital consumer products, such as LCD TVs and digital video recorders. This new DC/DC converter IC, the MB39A145, utilizes a “bottom detection comparator method”, and includes new enhanced circuits which provide changes in voltage, for changes in current to realize a more stable and low ripple output voltage. This improved stability subsequently reduces the number of external components that are needed, such as condensers, thus reducing space. The IC also includes Pulse Frequency Modulation (PFM) that is highly efficient in low-current ranges, and allows the equipment to have low power consumption in stand-by mode. Samples of the new converter IC will be available from January 2010.
27 October 2009 USA: Fujitsu’s New Printer Mechanism Offers Top-of-Line Speed and Reliability
Sunnyvale, CA, October 27, 2009 – Fujitsu Components America, Inc. today added a 24-volt, 3-inch thermal printer mechanism that offers OEMs ultra-fast print speeds, long-term operating reliability, and a compact footprint. These features reduce operating costs and downtime by increasing transaction efficiency in high-volume receipt printing applications.
30 September 2009 Japan: Fujitsu Develops World's First Millimeter-Wave Gallium-Nitride Transceiver Amplifier Chipset
Tokyo and Kawasaki, September 30, 2009 – Fujitsu Limited and Fujitsu Laboratories Ltd. announced today the development of the world's first gallium-nitride (GaN) HEMT-based transceiver amplifier chipset for broadband wireless transmission equipment operating in the millimeter bandwidth, the range of 70 to 100 GHz, for which widespread usage is expected to grow.
16 September 2009 Singapore: Fujitsu Launches Multimode, Multiband RF Transceiver IC
Singapore, September 16, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the first product in its entry into the mobile phone RF transceiver market, in launching a RF transceiver IC for mobile phones supporting 2G GSM/GPS/EDGE and 3G UMTS/HSPA protocols, that includes a 3G DigRF(*1) interface on a single chip.
14 September 2009 USA: Fujitsu Microelectronics Now Shipping Industry’s First 3G SAW-less Transceiver: a New Multimode, Multiband UMTS/ GPRS/EDGE Solution
Sunnyvale, Calif. , September 14, 2009 – Fujitsu Microelectronics Now Shipping Industry’s First 3G SAW-less Transceiver: a New Multimode, Multiband UMTS/ GPRS/EDGE Solution
14 September 2009 Japan: Fujitsu Launches Multimode, Multiband RF Transceiver IC
Tokyo, September 14, 2009 – Fujitsu Microelectronics Limited today announced the first product in its entry into the mobile phone RF transceiver market, in launching a RF transceiver IC for mobile phones supporting 2G GSM/GPS/EDGE and 3G UMTS/HSPA protocols, that includes a 3G DigRF interface on a single chip. The compact new transceiver IC also eliminates the need for external SAW filters and low-noise amplifiers (LNA), and enables mobile phone manufacturers to reduce component count, board space and bill of materials. Additionally, a new simplified programming model helps to significantly reduce development time and simplify integration of the RF into a radio platform. Samples of the MB86L01A transceiver IC are available from today.
27 August 2009: Fujitsu Microelectronics and TSMC to Collaborate on 28nm Process Technology
Tokyo and Hsin-chu, Taiwan, August 27, 2009 – Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they have agreed to collaborate on 28-nanometer (nm) process technology targeted for foundry production of Fujitsu Microelectronics’ 28nm logic ICs and to jointly develop an enhanced 28nm high-performance process technology by utilizing TSMC’s advanced technology platform.
27 August 2009 Japan and Taiwan: Fujitsu Microelectronics and TSMC to Collaborate on 28nm Process Technology
Tokyo and Hsin-chu, Taiwan , August 27, 2009 – Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they have agreed to collaborate on 28-nanometer (nm) process technology targeted for foundry production of Fujitsu Microelectronics’ 28nm logic ICs and to jointly develop an enhanced 28nm high-performance process technology by utilizing TSMC’s advanced technology platform. Previously, both companies announced that Fujitsu Microelectronics will collaborate with TSMC on 40nm production. This will extend Fujitsu Microelectronics’ 40nm collaboration with TSMC and covers joint development of an optimized 28nm high-performance process technology. Initial 28nm samples are expected to ship toward the end of 2010.
27 July 2009 USA: Fujitsu Now Shipping USB 3.0-SATA Bridge IC for PC Peripherals Supporting SuperSpeed USB 3.0
Sunnyvale, Calif. , July 27, 2009 – Fujitsu Now Shipping USB 3.0-SATA Bridge IC for PC Peripherals Supporting SuperSpeed USB 3.0
27 July 2009 Singapore: Fujitsu Releases New USB 3.0 - SATA Bridge IC for PC Peripherals
Singapore, July 27, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the new USB 3.0 - SATA (*1) bridge (*2) ICs, built with Fujitsu’s leading-edge proprietary physical layer device (PHY). It supports SuperSpeed USB, the USB 3.0 specification (*3), and enables data transfer rates of 5Gbps maximum between external storage devices – such as hard disk drives (HDDs) – and PCs.
27 July 2009 The Netherlands: Touch panel protector sheets
Hoofddorp, July 27, 2009 – Fujitsu Components Europe B.V., releases the new self-wetting adhesive protector sheets for touch screens and flat panel displays.
27 July 2009 Japan: Fujitsu Ships USB 3.0 - SATA Bridge IC for PC Peripherals
Tokyo, July 27, 2009 – Fujitsu Microelectronics Limited today announced the shipment of one of the first available USB 3.0 - SATA(1)bridge(2) ICs in the market, which supports SuperSpeed USB, the USB 3.0 specification(3), and enables data transfer rates of 5Gbps maximum between external storage devices – such as hard disk drives (HDDs) – and PCs. The new IC, the MB86C30A, is the first in the MB86C30 Series of USB 3.0-SATA bridge ICs, and when embedded in PC peripheral devices, enables over 10-fold faster data transfer rates in comparison to the USB 2.0 specification. In addition to the bridge functionality, the new IC also features a high-speed data encryption/decryption engine, offering high security without impairing the high-speed performance of USB 3.0. Samples of the new MB86C30A IC are available from today, July 27, 2009.
21 July 2009 USA: Digi-Key Corporation and Fujitsu Microelectronics Announce Worldwide Distribution Agreement
Thief River Falls, Minn. and Sunnyvale, Calif., July 21, 2009 – Digi-Key Corporation and Fujitsu Microelectronics Announce Worldwide Distribution Agreement
15 July 2009 USA: Fujitsu Microelectronics Now Offering New, Low-pin-count 8-bit Flash MCU Family, Ideal for Cost-Sensitive Consumer Appliance Applications
Sunnyvale, CA, July 15, 2009 – Fujitsu Microelectronics Now Offering New, Low-pin-count 8-bit Flash MCU Family, Ideal for Cost-Sensitive Consumer Appliance Applications
24 June 2009 Japan: Fujitsu Develops World's First Gallium-Nitride HEMT for Power Supply
Kawasaki, Japan, June 24, 2009 – Fujitsu Laboratories Ltd. today announced the development of a new structure for gallium-nitride high electron-mobility transistors (GaN)(HEMT) that can minimize power loss in power supplies, thus enabling reduced power consuFmption of electronic equipment such as IT hardware and home electronics. The new technology blocks the flow of current from power supplies in stand-by mode and produces high-density current when turned on (on-state current), and has the potential to cut power consumption of electronic equipment by one-third. If applied to data centers, Fujitsu's new GaN HEMT would be able to reduce total power consumption by 12%, thereby resulting in the effect of removing 330,000 tons of CO2 from Japan as a whole.
18 June 2009 The Netherlands: Solar Relays for a Sunny Future
Hoofddorp, June 18, 2009 – Fujitsu Components™ product range contains power relays that are recommended to be used in solar energy systems.
12 June 2009 Japan: Fujitsu Develops World's First 100 W-Class X-band High-Output Amplifier Featuring High Efficiency Exceeding 50%
Kawasaki, Japan, June 12, 2009 – Fujitsu Laboratories Limited today announced the development of the world's first 101-watt (101-W) X-band high-output amplifier achieving the world's highest efficiency of 53% using gallium nitride (GaN) high electron-mobility transistors (HEMTs).
11 June 2009 Japan: Fujitsu Achieves World's First Impulse Radio-Based Millimeter-Band Transmissions Exceeding 10 Gbps
Tokyo and Kawasaki, Japan, June 11, 2009 – Fujitsu Limited and Fujitsu Laboratories Ltd. today announced the development of the world's first impulse radio-based high-capacity wireless transmission equipment using millimeter-band transmissions in the 70-100 gigahertz (70-100 GHz) range band, resulting in throughput exceeding 10 gigabits-per-second (10 Gbps). This technology dispenses with the oscillators and other components that have been required in conventional wireless transmission technologies, enabling compact and inexpensive millimeter-band transmission equipment. The new technology is suitable as an alternative to fiber-optic trunk lines in regions where those lines would be difficult to lay, as a way to bridge the digital divide, and can also be used for ultra-fast wireless LANs.
2 June 2009 USA: Fujitsu Leads Project Team to Deliver WiMAX VoIP Devices to Smile Communications to Serve Developing Countries
Tokyo, Japan and Johannesburg, South Africa, June 2, 2009 – Fujitsu Leads Project Team to Deliver WiMAX VoIP Devices to Smile Communications to Serve Developing Countries
2 June 2009 Germany: Fujitsu Exhibits Comprehensive Range of WiMAX Solutions
Langen, Germany and Amsterdam, June 2, 2009 – Come and meet Fujitsu on Stand 3.22
2 June 2009 Germany: Fujitsu Expands WiMAX Terminal Ecosystem with Teltonika
Langen, Germany and Amsterdam, June 2, 2009 – Fujitsu Expands WiMAX Terminal Ecosystem with Teltonika
2 June 2009 Japan, South Africa, EMEA: Fujitsu Leads Project Team to Deliver WiMAX VoIP Devices to Smile Communications to Serve Developing Countries
Tokyo, Japan and Johannesburg, South Africa, June 2, 2009 – Fujitsu Microelectronics Limited and Smile Telecoms Holdings Limited today announced the realization of the world's first WiMAX Voice-over-IP (VoIP) phone and service for developing countries, enabled through the creation of an eco-system encompassing mobile carrier, handset, semiconductor and module partners.
26 May 2009 Germany: Fujitsu and ADD Collaborate to Bring Advanced Metering Solutions to Market
Langen, Germany, May 26, 2009 – Companies sign MoU to develop PRIME based SoCs for AMM market
22 May 2009 Singapore: Fujitsu Launches World’s First 125°C Spec. Low Power Memory for SiPs
Singapore, May 22, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the launch of two new Consumer FCRAM(*1) memory chips featuring an operating temperature range that has been extended to a high-temperature of 125°C for the first time in memory with a DDR SDRAM interface.
19 May 2009 Japan: Fujitsu Launches World’s First 125°C Spec. Low Power Memory for SiPs
Tokyo, May 19, 2009 – Fujitsu Microelectronics Limited today announced the launch of two new Consumer FCRAM memory chips featuring an operating temperature range that has been extended to a high-temperature of 125°C for the first time in memory with a DDR SDRAM interface. Sample shipment of the two new FCRAM products, the 512Mbit (MB81EDS516545), and 256Mbit (MB81EDS256545), will begin from today. These products are low power consumption memory optimized for use in system-in-packages (SiPs) in digital consumer products such as digital TVs and digital video camcorders.
13 May 2009 Singapore: Fujitsu Releases New Full HD H.264/MPEG-2 Transcoder ICs
Singapore, May 13, 2009 – Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced 2 new transcoder ICs that can convert between Full HD (1920 dots x 1080 lines) MPEG-2 (*1) video data and H.264 (*2) video data, as well as transcoding between audio formats while featuring a low power consumption of only 1.0Watt(W) including the in-package memory. These new ICs are targeted to support the growing number of electronic equipment that can record digital broadcasts.
8 May 2009 Japan: Fujitsu Releases New Full HD H.264/MPEG-2 Transcoder ICs
Tokyo, May 8, 2009 – Fujitsu Microelectronics Limited today announced 2 new transcoder ICs that can convert between Full HD (1920dots x 1080lines) MPEG-2 video data and H.264 video data, as well as transcoding between audio formats while featuring a low power consumption of only 1.0Watt(W) including the in-package memory. These new ICs are targeted to support the growing number of electronic equipment that can record digital broadcasts. By employing Fujitsu’s proprietary transcode technology, Fujitsu Microelectronics realized industry-leading low power consumption. Combined with the small form-factor packaging, these ICs can be used not only for non-mobile fixed electronic equipment – such as digital video recorders (DVRs) - but also in such mobile products such as notebook PCs. In addition to the transcode function, security functions are included on a single chip to make it easy for customers to create their systems. Sample shipment of the new transcoder ICs, the MB86H57 and MB86H58, will begin from late July, 2009.
6 May 2009 USA: New Technology Backgrounder from Fujitsu Microelectronics Describes the Advantages of the 1394 Automotive Standard for In-Vehicle Networks
Sunnyvale, CA, May 6, 2009 – Details on New MB88395 Controller for 1394 Automotive Networking Applications

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