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2003 Press Releases by Region
Americas
- 17 December 2003 USA
- Fujitsu Announces Availability of New fi-4860C Color Scanner with Ultrasonic Double-Feed Detection
San Jose, CA, December 17, 2003 – Fujitsu Computer Products of America, Inc. (FCPA), a market leader in document imaging scanners and services, today announced volume availability of its new fi-4860C production-level scanner equipped with state of the art ultrasonic double-feed detection technology, which helps prevent lost images and enables larger batches of mixed document types to be scanned quickly, reliably, and automatically. With the addition of ultrasonic technology, Fujitsu's fi-4860C becomes the first scanner in the document imaging market to include three independent methods to detect document double-feeds -- the scanner is also equipped with infrared and length sensors. All three detection methods can be used separately or can be combined to accommodate a wide variety of document environments.
- 17 December 2003 Germany / USA
- Joint Forces to Provide PRIMECLUSTER High Availability for Novell's Nterprise Linux Services
Munich, Germany / Provo, UT, USA, December 17, 2003 – Fujitsu Siemens Computers and Novell today announced that the cluster product suite PRIMECLUSTER™ from Fujitsu Siemens Computers and the Fujitsu Group of companies has been successfully tested and customized for the soon-to-be-released Novell® Nterprise™ Linux Services and is available for mission-critical business solutions.
- 16 December 2003 USA
- Fujitsu Introduces New Rack-Optimized PRIMERGY RXI600 Server with Intel Itanium 2 Processor
Sunnyvale, CA, December 16, 2003 – Fujitsu Computer Systems today announced its new Intel® Itanium® 2-based PRIMERGY®RXI600, a high performance 64-bit, 4-way rack server to round out the company's Intel-based product portfolio and offer enterprise customers a foundation for the future.
- 16 December 2003 USA
- Fujitsu Microelectronics America & Cogent Systems Provide Comprehensive Fingerprint Biometric Solutions
Sunnyvale, CA, December 16, 2003 – Fujitsu Microelectronics America, Inc. (FMA), a leader in biometric fingerprint sensor hardware, and Cogent Systems Inc., a leading developer of integrated biometric solutions, will collaborate on the development of new biometric security designs for government and commercial applications. The two companies will develop solutions for network security, physical and logical access control, positive ID for identity documents, and mobile/wireless security.
- 16 December 2003 USA
- Staples Fastens on Fujitsu to Expand IT Services Partnership
Frisco, TX, December 16, 2003 – Based on its ability to meet or beat stringent service performance metrics and contribute to significantly reduced costs for in-store technologies, Fujitsu Transaction Solutions Inc. has expanded its relationship with Staples, Inc. (NASDAQ: SPLS), the largest operator of office superstores in the world.
Asia
- 25 December 2003 Japan
- Fujitsu and Sumitomo Electric Establish Joint Venture in Compound Semiconductor Devices
Tokyo, December 25, 2003 – Fujitsu Limited and Sumitomo Electric Industries, Ltd. today announced that they have reached a basic agreement to create a joint venture that will consolidate the operations of Fujitsu Quantum Devices Limited, a wholly owned subsidiary of Fujitsu that is focused on the development, manufacture and sales of compound semiconductors, with the electronic devices business of Sumitomo Electric's compound semiconductor operations. Fujitsu and Sumitomo Electric will each have an equal equity ownership in the joint venture.
- 22 December 2003 Japan
- Fujitsu Develops World's First Touch Panel Using Conductive Polymer Film
Tokyo, December 22, 2003 – Fujitsu Laboratories Ltd. and Fujitsu Component Limited today announced the joint development of the world's first resistive touch panel that uses a conductive polymer film, a transparent conductive film that offers durability 10 times that of the conventional ITO film and succeeds in reducing production costs to less than half. Volume production capabilities for this breakthrough technology have been confirmed.
- 17 December 2003 Japan
- Notice Regarding the Total Value of the Sale of Shares of FANUC (Including the Greenshoe Option)
Tokyo, December 17, 2003 – Fujitsu Limited ("Fujitsu") today announced the total value of the sale of the portion of its shareholdings in FANUC LTD. (FANUC) that it has announced to sell, on October 28 and November 12, 2003, through a secondary offering (the "Offering"), as Nikko Citigroup, the holder of the option to purchase up to 3,600,000 additional shares (the "Greenshoe Option"), has decided to exercise this option for 2,207,700 shares. Details are as below.
- 15 December 2003 Japan
- Fujitsu Achieves Breakthrough in Ultrafine-Pitch Solder Bumping and Flip-Chip Bonding
Tokyo, December 15, 2003 – Fujitsu Limited today announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps, and high-precision flip-chip bonding interconnection. This breakthrough technology increases connection density by approximately 50 times compared to conventional flip chip interconnections and actualizes downsizing of LSIs and LSI packaging.
- 8 December 2003 Japan
- Fujitsu Achieves Breakthrough Output with Gallium Nitride HEMT Amplifier
Kawasaki, December 8, 2003 – Fujitsu Laboratories Ltd. today announced that it has developed a gallium nitride (GaN) high electron mobility transistor (HEMT) amplifier (Figure 1) which achieves the world's highest power output of 174 watts at 63 volts, while demonstrating unprecedented record drain efficiency of 40%, fulfilling W-CDMA system requirements for base stations. This breakthrough represents a significant step forward in making smaller and more energy efficient base stations for 3G mobile networks, and overcomes the technical hurdle for output needs exceeding 150 watts required for realistic application in 3G mobile systems.
Europe
- 22 December 2003 Germany
- Fujitsu Siemens Computers Outperforms European SME Market and Strengthens its Number 3 Position
Munich, December 22, 2003 – Fujitsu Siemens Computers provided further verification of how successful its sales and marketing strategy for the small and medium sized enterprise (SME) market has proven to be. Europe’s leading IT company outperformed the European SME market in the third quarter 2003, achieving 18 percent year-on-year growth in a market that expanded by only 3 percent, according to IDC revenue figures for sales of PCs and x86 (Intel-architecture) servers. According to the data, Fujitsu Siemens Computers holds the number 3 spot in this segment in the Europe, Middle East and Africa (EMEA) region with an 11 percent market share.
- 18 December 2003 Germany
- Fujitsu Siemens Computers' Best-Suited Hardware for Linux Wears a New Hat
Munich, December 18, 2003 – Fujitsu Siemens Computers provided further verification of how successful its sales and marketing strategy for the small and medium sized enterprise (SME) market has proven to be. Europe’s leading IT company outperformed the European SME market in the third quarter 2003, achieving 18 percent year-on-year growth in a market that expanded by only 3 percent, according to IDC revenue figures for sales of PCs and x86 (Intel-architecture) servers. According to the data, Fujitsu Siemens Computers holds the number 3 spot in this segment in the Europe, Middle East and Africa (EMEA) region with an 11 percent market share.
- 18 December 2003 UK
- Futuremedia Selects Fujitsu Siemens Computers to Deliver e-Learning to Thousands of UK Homes
Bracknell, December 18, 2003 – Fujitsu Siemens Computers, which has already established an enviable track record in Home Computing, will be the provider of choice of PCs and/or laptops to be installed at Royal Mail employees’ homes for all orders resulting from the first of six marketing campaigns. This ensures that all subscribers of this first campaign, ending on December 23, will have the best means of using the resources provided by the Learning For All? programme, including innovative and exciting e-Learning content through Futuremedia’s Learning Management System.
- 17 December 2003 Germany
- Fujitsu Siemens Computers Offers Complete Package Based on Unicenter NSM from Computer Associates
Munich, December 17, 2003 – Fujitsu Siemens Computers announced that it will extend its global partnership with US-based Linux and open source technology provider Red Hat into sales. As a result, the leading European computer company is now able to directly offer its customers all Red Hat products and thus act as a single source supplier. At the same time, Fujitsu Siemens Computers is now a Red Hat Premier Partner.
- 17 December 2003 Germany / USA
- Joint Forces to Provide PRIMECLUSTER High Availability for Novell's Nterprise Linux Services
Munich, Germany / Provo, UT, USA, December 17, 2003 – Fujitsu Siemens Computers and Novell today announced that the cluster product suite PRIMECLUSTER™ from Fujitsu Siemens Computers and the Fujitsu Group of companies has been successfully tested and customized for the soon-to-be-released Novell® Nterprise™ Linux Services and is available for mission-critical business solutions.
Japan (Headquarters)
- 25 December 2003 Japan
- Fujitsu and Sumitomo Electric Establish Joint Venture in Compound Semiconductor Devices
Tokyo, December 25, 2003 – Fujitsu Limited and Sumitomo Electric Industries, Ltd. today announced that they have reached a basic agreement to create a joint venture that will consolidate the operations of Fujitsu Quantum Devices Limited, a wholly owned subsidiary of Fujitsu that is focused on the development, manufacture and sales of compound semiconductors, with the electronic devices business of Sumitomo Electric's compound semiconductor operations. Fujitsu and Sumitomo Electric will each have an equal equity ownership in the joint venture.
- 22 December 2003 Japan
- Fujitsu Develops World's First Touch Panel Using Conductive Polymer Film
Tokyo, December 22, 2003 – Fujitsu Laboratories Ltd. and Fujitsu Component Limited today announced the joint development of the world's first resistive touch panel that uses a conductive polymer film, a transparent conductive film that offers durability 10 times that of the conventional ITO film and succeeds in reducing production costs to less than half. Volume production capabilities for this breakthrough technology have been confirmed.
- 17 December 2003 Japan
- Notice Regarding the Total Value of the Sale of Shares of FANUC (Including the Greenshoe Option)
Tokyo, December 17, 2003 – Fujitsu Limited ("Fujitsu") today announced the total value of the sale of the portion of its shareholdings in FANUC LTD. (FANUC) that it has announced to sell, on October 28 and November 12, 2003, through a secondary offering (the "Offering"), as Nikko Citigroup, the holder of the option to purchase up to 3,600,000 additional shares (the "Greenshoe Option"), has decided to exercise this option for 2,207,700 shares. Details are as below.
- 15 December 2003 Japan
- Fujitsu Achieves Breakthrough in Ultrafine-Pitch Solder Bumping and Flip-Chip Bonding
Tokyo, December 15, 2003 – Fujitsu Limited today announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps, and high-precision flip-chip bonding interconnection. This breakthrough technology increases connection density by approximately 50 times compared to conventional flip chip interconnections and actualizes downsizing of LSIs and LSI packaging.
- 8 December 2003 Japan
- Fujitsu Achieves Breakthrough Output with Gallium Nitride HEMT Amplifier
Kawasaki, December 8, 2003 – Fujitsu Laboratories Ltd. today announced that it has developed a gallium nitride (GaN) high electron mobility transistor (HEMT) amplifier (Figure 1) which achieves the world's highest power output of 174 watts at 63 volts, while demonstrating unprecedented record drain efficiency of 40%, fulfilling W-CDMA system requirements for base stations. This breakthrough represents a significant step forward in making smaller and more energy efficient base stations for 3G mobile networks, and overcomes the technical hurdle for output needs exceeding 150 watts required for realistic application in 3G mobile systems.
